Johanson Technology's new "GBBL" microwave broadband capacitors feature high capacitance per case size without sacrificing the temperature stability associated with high dielectric constant materials. GBBL broadband capacitors feature a proprietary X7R composition which is manufactured by a two step, atmospheric controlled sintering process. The resulting microstructure is composed of a conducting titanate ceramic grain in contact with an insulating Grain Boundary Layer (GBBL). The insulating boundary layer acts as a very thin dielectric. The process control of the boundary thickness, in conjunction with the conductive grain size, provides the cumulative effect of a very high, yet stable, dielectric constant.

gbbl broadband single layer capacitors
Key Features:
  • GBBL Dielectric Yields High Volumetric Efficiency
  • Stable Temperature Coefficient: ±15% Max (-55°C to 125°C)
  • Reduced Microphonics
  • Offered With or Without Borders
  • Thin Film TiW/Au or TiW/Ni/Au Electrodes
  • RoHS
Custom sizes are available - Consult Factory. gbbl broadband single layer capacitors and typical comparison

Dielectric Characteristics

TEMPERATURE COEFFICIENT:±15%, -55 to 125°CDIELECTRIC STRENGTH:2.5 X WVDC Min., 50 mA max
VOLTAGE RATING:16 - 50 VDCTEST PARAMETERS:1kHz ±50Hz, 1.0±0.2 VRMS, 25°C
DISSIPATION FACTOR:.025 (2.5%) maxINSULATION RESISTANCE:10 G Typ.
AVAILABLE CAPACITANCE: 68 pF - 3900 pF
gbbl-slc temperature coefficient

Size and Capacitance Selection

gbbl-slc  border Style U Configuration
Border Style "U" Configuration
gbbl-slc border Style V & B Configuration
Border Style "V" & "B" Configuration
BORDER U V, B U V, B U V, B U V, B
SIZE 01 02 03 04
W in .015 ±.005 .025 ±.005 .035 ±.005 .050 ±.010
(mm) (0.38 ±.13) (0.64 ±.13) (0.89 ±.13) (1.27 ±.25)
L in .015 ±.005 .025 ±.005 .035 ±.005 .050 ±.010
(mm) (0.38 ±.13) (0.64 ±.13) (0.89 ±.13) (1.27 ±.25)
T in .007 ± .002 .007 ± .002 .007 ± .002 .007 ± .002
(mm) (0.18 ± .05) (0.18 ± .05) (0.18 ± .05) (0.18 ± .05)
B in n/a .002±.001” n/a .002±.001” n/a .002±.001” n/a 002±.001”
(mm)   (0.05±.03)   (0.05±.03)   (0.05±.03)   (0.05±.03)
Capacitance
   pF     Code
U01 V01
B01
U02 V02
B02
U03 V03
B03
U04 V04
B04
75 750 50V 50V            
82 820 50V 50V            
100 101 50V 50V            
120 121 50V 50V            
150 151 50V 50V            
220 221 25V 25V            
270 271 25V 16V   50V        
330 331 16V 16V 50V 50V        
390 391 16V 16V 50V 50V        
390 391 16V 16V 50V 50V        
470 471 16V   50V 25V        
560 561     25V 25V        
680 681     25V 16V   50V    
750 751     16V 16V 50V 50V    
820 821     16V 16V 50V 25V    
1000 102     16V 16V 25V 25V    
1200 122     16V   25V 16V   50V
1500 152         16V 16V 50V 50V
1800 182         16V 16V 50V 25V
2200 222         16V   25V 25V
2700 272             25V 16V
3300 332             16V 16V
3900 392             16V  

Waffle Pack Opening Procedure

Discrete Devices packaged in Waffle Packs normally have room to move around within the pocket. Sometimes parts may stick to the paper insert usually placed between the top of the package and the lid. Parts can easily jump out of an open package subject to small vibrations, static charge or strong airflow. Smaller parts are more susceptible to jumping out of, or being blown out of, the pockets of an open waffle pack. To minimize the risk of losing parts, implementation of the following procedures at incoming inspection or at the point of use on the production floor are recommended.

1. Holding the clip with one hand, use the thumb of one hand and thumb and fingers of the other hand to slide the waffle “tray” and the lid out of the clip without allowing the tray and lid to separate. JTI recommends using gloves when opening discrete device packaging.

Waffle Pack Opening Procedure fig. 1

2. Carefully slide the tray and lid onto a flat surface without allowing the tray and lid to separate. The work area should have static reduction measures in place such as a grounded, dissipative work surface and ionizing fans. It should be free of strong drafts, particularly for parts smaller than 20 mil X 20 mil (0.5 X 0.5 mm).

Waffle Pack Opening Procedure fig. 2

3. Hold down two diagonal corners with one hand to keep the lid securely on top of the tray and use tweezers or another small tool to gently tap the lid at the two exposed corners and the center of the lid. This should cause any parts that may be stuck to the insert to fall back into the cavity.

Waffle Pack Opening Procedure fig. 3

4. Carefully lift the lid straight up to remove from the tray, turn the lid upside down and place it on the flat surface next to the tray. Parts should be removed from the package with a vacuum pen with an appropriate end tip. CAUTION: Tweezers can cause damage to discrete components.

Waffle Pack Opening Procedure fig. 4

NOTE: An alternative to Waffle Packs are Gel-Paks. These packages will hold discrete devices more securely. The tradeoff is that a vacuum fixture may be required for easy removal from the surface and there may be an incrementally higher cost for the Gel-Pak.

Waffle Pack Opening Procedure fig. 5

Alternate part numbering for Rectangular parts

Alternate part numbering for Rectangular parts

How to Order

How to order GBBL part number breakdown