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Home Product Catalog RF Capacitors High-Q Multi-Layer Capacitors (RoHS) Available Capacitance Selection Dielectric Characteristics EIA 1111 Capacitor Spec E-Series Termination and Leads, EIA 1111 - 3838 Graphical Data, EIA 1111-2525 Mechanical Characteristics Mechanical & Environmental Characteristics Part Number Breakdown Overview & PDF RF Characteristics, EIA 0201 RF Characteristics, EIA 0402-0603 Series Resonance Chart Soldering Requirements and Profile LASERtrim®, RF Tuning Electrical Characteristics Mechanical Characteristics Model Selection Overview & PDF RF Characteristics Part Number Breakdown Tuning Description Single-Layer, Broadband Capacitors (GBBL) Broadband Capacitor Overview Dielectric Characteristics Part Number Breakdown Size & Capacitance Selection Single-Layer, Microwave / Millimeterwave Dielectric Characteristics Environmental Characteristics Metalization Characteristics Overview & PDF Part Number Breakdown U, V, & B Series SLC Temperature Characteristics U-Series Standard Single Layer Capacitors V & B-Series Capacitance Selection V & B-Series Mechanical Characteristics Integrated Passives Overview & PDF Antennas Overview Available RF Antennas Antenna Switch Modules Baluns Balun-Filter Combos Band-Pass Filters Case Size Summary Chipset Specific Baluns and Balun-Filter Combos Couplers Diplexers EMI Filter Arrays Example Circuit Diagram High Pass Filters Integrated Passive Tape & Reel Packaging Int. Passives Part Number Explanation Low Pass Filters Mechanical & Environmental Characteristics Power Dividers Silver Leaded Components' Storage and Soldering Profile Typical Soldering Profile RF Inductors RF Ceramic Chip Inductors Inductance Range / Electrical Characteristics Mechanical Characteristics Mechanical & Environmental Characteristics Overview & PDF Packaging Information Part Number Breakdown Product Range Summary RF Characteristics Typical Soldering Profile RF WireWound Chip Inductors Inductance Range / Electrical Characteristics Mechanical Characteristics Mechanical & Environmental Characteristics Overview & PDF Packaging Information Part Number Breakdown Product Range Summary RF Characteristics RF Wirewound Capacitor Soldering Profile S-Parameter Files Wirewound Inductor Cross Reference Modules & Substrates Custom LTCC Module Foundry Service Custom Thin Film Metalized Substrates Code Charts Mechanical Characteristics Overview & PDF Part Number Breakdown Application Specific AMR: Automated Meter Reading Automated Meter Reading [PDF] EMI Filter Array (LTCC) Products [PDF] GPS Antenna Application Products [PPS] GPS Products [PDF] Overview & PDFs UWB Products [PDF] WiMax Products [PDF] Wifi Dual Band Products [PDF] 2.45 GHz Wifi Products [PDF] 5.5 GHz Wifi Products [PDF] 900 MHz Solution [PDF] Legacy Product C-Series High Frequency SMT MLCCs Available Capacitance Selection Dielectric Characteristics Mechanical Characteristics Mechanical & Environmental Characteristics Overview & PDF Part Number Breakdown RF Characteristics S-Parameter Files Power-Q High Voltage RF MLCCs Capacitance / Voltage Selection Electrical Characteristics Lead Style Selection Overview & PDF Part Number Breakdown Porcelain Substitute NPO Ceramic Caps Available Capacitance Selection Dielectric Characteristics Mechanical & Environmental Characteristics Overview & PDF Part Number Breakdown RF Characteristics Technical Notes Overview RoHS Compliance Tape & Reel Packaging Chip Capacitor Tape & Reel Packaging Inductor Tape & Reel Packaging RF Antenna Tape & Reel Packaging RF Component Tape & Reel Packaging RF Capacitors & Inductors Capacitor Mounting & S-Parameters Capacitor RF Current & Power Dishal Bandpass Filter Tuning Using LASERtrim® Chip Caps High Frequency Inductor Modeling Utilizing MLISoft® Measuring S-Parameters of High-Q Caps Q & ESR Explained Reference Oscillator Tuning Using LASERtrim® Chip Caps Soldering Requirements for MLCC S-Parameter Accuracy SRF & PRF for RF Capacitors Storage and Solderability Checklist Trimming Characteristics of LASERtrim® Chip Caps Inductor Orientation Marking Benefits (RF Study) Integrated Passives (RF Comp) Antenna Bandwidth Expansion Guide Chip Antenna Layout Considerations for 802.11 Chip Balun: Definitions & Measurement Methodology JTI Chip Antenna Mounting and Tuning Techniques Silver Leaded Components' Storage and Soldering Profile 2500AT43A0100 Frequency Tuning 2450BM14A0002 Matched Balun for Nordic nRF24L01/nRF24L01+ 2450BM15A0002 Matched Balun for T.I. 253X Family Chipsets Prototyping Kits Capacitor Designer Kits Designer Kit for WiMAX & UWB Dual Capacitor and Inductor Designer Kits Inductor Designer Kits Non-Magnetic Capacitor Designer Kit Non-Magnetic Capacitor Tuning Kit Overview & PDF Single Layer Capacitor Kits Tuning Capacitor Kits WireWound Inductor Designer Kits 2.45 Ghz Designer Kit for WLAN, Bluetooth, ISM and 802.11 5.5 Ghz Designer Kit for WLAN, Bluetooth, ISM and 802.11 Cross Reference Charts Capacitor Cross Reference C-Series to S-Series Cross Reference Monolithic Inductor Cross Reference Wirewound Inductor Cross Reference Modeling Software Download JTIsoft® Overview Designer Libraries Agilent ADS Libraries AWR MWO Libraries Eagleware Genesys Libraries Modelithics Global Models Overview S-Parameter Files My Account

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Part Number Search   Parameter Search Volt 6.3101625501002002503005001000125015001600250036007200 Size 0100502010402050806030805080611111206121018122225252038384035 Cap Value 0.10.20.30.40.50.60.70.80.911.11.21.31.41.51.61.71.81.922.12.22.32.42.733.33.63.94.34.75.15.66.26.878.28.799.11011121315161819202223242730333639404347566875821001201501802202703303904705606808201000120015001800220027003300390047005600630068007500820010000       RF Components Select Type Antenna Switch Modules Antennas Balun-Filters Baluns Band Pass Filters Couplers Chipset Specific Baluns Diplexers EMI Filter Arrays High Pass Filters Low Pass Filters Power Dividers