Mechanical & Environmental Characteristics

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	Specification	Test Parameters
Solderability:	Solder coverage 90% of metalized areas.	Preheat chip to 120°-150°C for 60 sec. Dip terminals in rosin flux then dip in 62Sn/36Pb/2Ag solder @ 240±5°C Dip time = 5±1 sec.
Resistance to Soldering Heat:	Chip should not crack. Solder coverage 80%	Preheat chip to 120°-150°C for 60 sec. Dip terminals in rosin flux then dip in 62Sn/36Pb/2Ag solder @ 260±5°C Dip time = 10±1 sec.
Terminal Adhesion:	Termination should not pull off. Ceramic should remain undamaged.	Linear pull force exerted on axial leads soldered to each terminal. Terminal strength: 2.0Lbs for 0402, 2.0Lbs for 0603, 5.0Lbs for 0805
PCB Deflection:	No mechanical damage. Cap. change: 2% or .5pF Max	Glass Epoxy PCB: 1 mm deflection
Life Test:	Cap. change: 2% or .5pF Max I.R. = Initial value	1000 Hours, 125°C, 200% rated voltage
Thermal Shock:	Cap. change: 2% or .5pF Max I.R. = 70% of initial value	5 CYCLES: 30±3 minutes @ -55°C, 3 min. @ 25°C, 30±3 min. @ +125°C, 3 min. @ 25°C
Moisture Resistance:	Cap. change: 2% or .5pF Max I.R. = 70% of initial value	240 Hours, 85% Relative Humidity, 85°C, 1.5 VDC