Modules and Substrates

Custom LTCC Module Foundry Service Johanson Technology has the capability to produce a wide range of application specific components for wireless communication such as Diplexer Switch, VCO, PA and highly integrated RF modules using LTCC (Low Temperature Co-fired Ceramic) technology. We offer extensive expertise using DuPont, Ferro and internally developed LTCC tape systems. Read more about our Custom LTCC Module Foundry Service

Custom Thin Film Metalized Substrates Johanson Technology offers a wide range of dielectrics for use in application specific environments. These materials are available in both lapped and "as fired" conditions as well as metalized and non-metailzed substrates. Substrate sizes range from 0.50" X 0.50" to 2" X 2" depending on thickness. Read more about our Custom Thin Film Metalized Substrates