Metallization Characteristics |
| Metallization Type |
TiW/Au (Titanium-Tungsten/Gold) |
TiW/Ni/Au (Titanium-Tungsten/Nickel/Gold) |
| Termination Code |
T |
N |
| Attachment Compatibility |
Wire / Ribbon Bonding
Silver or Gold Conductive Epoxy
Au/Ge or Au/Si Eutectic Preform
Excellent High Temperature Resistance (400°C)
Unsuitable for Pb/Sn or Au/Sn Soldering |
Pb/Sn or Au/Sn Soldering
Au/Sn Eutectic Preform
Moderate High Temp. Resistance (325°C)
Long term high temperature may cause Ni diffusion and wire bond problems on Au/Ge |
SLC thick-film terminations ( legacy codes "G" and "9") are still supported. Contact the factory for compatibility information.
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