|
Mechanical & Environmental Characteristics |
| | Specification | Test Parameters |
| Solderability: |
Solder coverage ≥ 75% of electrodes L = ± 10% Q = ±20% |
Preheat 120±20°C for 1 min. Dip 230±10°C for 3±1 sec. |
| Resistance to soldering: |
No apparent damage Solder coverage ≥ 75% L = ± 10% Q = ± 20% |
Preheat 120±20°C for 1 min. Dip 260±10°C for 10±1 sec. |
| Thermal Shock: |
No apparent damage L = ± 10% Q = ± 20% |
100 cycles: 30±3 minutes @+100°C then 30±3 min. @ -40°C |
| Life Test: |
No apparent damage L = ± 10% Q = ± 20% |
1000 ±48 Hours @ +85±2°C, rated current (1-2 hour recovery) |
| Humidity Resistance: |
Inductance change 2% or .5pF Max |
1000 ±48 Hours @ +40±2°C, 90 - 95% relative humidity. Rated current (1-2 hour recovery) |
| Terminal Adhesion:: |
Termination should not pull off.
Ceramic should remain undamaged. |
Lateral pull force. 0201 ≥ 1.0Lbs 0402 ≥ 1.6Lbs For 0603 ≥ 2.2Lbs For 0805 ≥ 4.4Lbs |
| PCD Deflection: |
No mechanical damage. |
Glass Epoxy PCB: 1mm deflections |
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RF Inductors 
