Overview:

High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance.

These RF chip inductors are compact in size and feature lead-free tin plated nickel barrier terminations and tape and reel packaging which makes them ideal for small size/high volume wireless applications.

Applications & Features:

• CELL/PCS RF Modules
• Wireless LAN
• Broadband Components
• RFID
• RF Transceivers
• RoHS Compliant (Standard, "V" Code)
• Sn/Pb Terminations Optional ("T" Code)