About Johanson Technology:

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• 2011 Johanson Technology Product Catalog

Support:

• Request a Quote
• Request a Sample
• Request a Prototyping Kit
• Request Hard Literature
• Ask a Technical Question
• Request JTISoft® Download
• 2010 Johanson Technology Product Catalog

JTI Modeling Software:

• JTIsoft® Modeling software
  • JTIsoft® Modeling Overview
  • Request JTISoft® Download

Designer Libraries:

• Designer Libraries
• Designer Libraries
• S-Parameter Files
  • S-Parameter Files
  • C-Series Capacitors [obsolete]
  • L-Series Capacitors (Series-Through)
  • L-Series Capacitors (Shunt-Through)
  • S-Series Capacitors (Series-Through)
  • S-Series Capacitors (Series-Through Measured Over FR-4)
  • S-Series Capacitors (Shunt-Through)
  • E-Series Capacitors
  • Antennas
  • Baluns
  • Band Pass Filters
  • Couplers
  • Diplexers
  • Low Pass Filters
  • Filter-Baluns, Monolithic
  • UWB Filters
  • Inductors, Monolithic
  • Inductors, Wirewound
• Agilent ADS Libraries
• AWR MWO Libraries
• Eagleware Genesys Libraries
• Modelithics Global Models

Technical Notes:

• Technical Notes Overview
• RoHS Compliance
• Chip Capacitor Tape & Reel Packaging
• Chip Capacitor Tape & Reel Packaging
• RF Antenna Tape & Reel Packaging
• RF Component Tape & Reel Packaging
• Chip and Wirewound Inductor Packaging Information
• Storage and Solderability Checklist
• Storage and Solderability Checklist
• Q & ESR Explained
• SRF & PRF for RF Capacitors
• Measuring S-Parameters of High-Q Caps
  • Frequencies 50-6950
  • Frequencies 7000 - 13950
  • Frequencies 14000-20050
• S-Parameter Accuracy
• Capacitor Mounting & S-Parameters
• Capacitor RF Current & Power
• Trimming Characteristics of LASERtrim® Chip Caps
• Dishal Bandpass Filter Tuning Using LASERtrim® Chip Caps
• Reference Oscillator Tuning Using LASERtrim® Chip Caps
• High Frequency Inductor Modeling Utilizing MLISoft®
• Soldering Requirements for MLCC
• Chip Balun: Definitions & Measurement Methodology
• 2450BM15A0002 Matched Balun for the Texas Instruments CC2530/31 ZigBee Transceivers
• Chip Antenna Layout Considerations for 802.11
• JTI Chip Antenna Mounting and Tuning Techniques
• 2500AT43A0100 Frequency tuning
• Antenna Bandwidth Expansion Guideline
• AMR: Automated Meter Reading

Cross reference Charts:

• Cross Reference Charts
• Capacitor Cross Reference
• Monolithic Inductor Cross Reference
• Wirewound Inductor Cross Reference
• C-Series to S-Series Cross Reference

Legacy Products:

• Legacy Products
• High Frequency Capacitors, SMT MLCCs
• High Frequency Capacitors, SMT MLCCs
• Available Capacitance Selection
• Mechanical Characteristics
• Dielectric Characteristics
• Mechanical & Environmental Characteristics
• RF Characteristics
• Part Number Breakdown
• S-Parameter Files
• Power-Q High Voltage RF MLCCs
• Power-Q High Voltage RF MLCCs
• Capacitance / Voltage Selection
• Electrical Characteristics
• Lead Style Selection
• Part Number Breakdown
• Porcelain Substitute NPO Ceramic Caps
• Porcelain Substitute NPO Ceramic Caps
• Available Capacitance Selection
• Dielectric Characteristics
• Mechanical & Environmental Characteristics
• RF Characteristics
• Part Number Breakdown

Modules and Substrates

• Modules and Substrates
• Custom LTCC Module Foundry Service
• Custom Thin Film Metalized Substrates
• Custom Thin Film Metalized Substrates
• Code Charts
• Mechanical Characteristics

Application Specific Products:

• Application Specific Products

RF Capacitors and Inductors:

• RF Capacitors
• Multi-Layer High-Q Capacitors, HiQ MLCC, HiQ Capacitors, SMD Capacitors, Low ESR Capacitors
• Lead Free Capacitors, RF Capacitors, Ceramic Chip Capacitors, RoHS Capacitors
• Multi-Layer High-Q Capacitors, HiQ MLCC, HiQ Capacitors, SMD Capacitors, Low ESR Capacitors (Overview)
• Low ESR / High-Q Capacitor Selection Chart
• Dielectric Characteristics
• Mechanical Characteristics
• Mechanical & Environmental Characteristics
• Series Resonance Chart
• RF Characteristics - L-Series
• S-Series RF Characterisitcs versus Frequency
• Graphical Data, EIA 1111-2525
• Part Number Breakdown
• E-Series Termination and Leads, EIA 1111 - 3838
• LASERTrim® Capacitors, RF Tuner Caps
• LASERTrim® Capacitors, RF Tuner Caps
• Model Selection
• Tuning Description
• RF Characteristics
• Electrical Characteristics
• Mechanical Characteristics
• Part Number Breakdown
• Broadband Capacitors
• Dielectric Characteristics
• Size & Capacitance Selection
• Part Number Breakdown
• Microwave Single Layer Capacitors
• Microwave Single Layer Capacitors
• Dielectric Characteristics
• V & B-Series Capacitance Selection
• V & B-Series Mechanical Characteristics
• U-Series Standard Single Layer Capacitors
• SLC Temperature Characteristics
• Metallization Characteristics
• Part Number Breakdown U, V, & B Series
• Environmental Characteristics
• Waffle Pack Opening Procedure


• RF Inductors
• RF Inductors
• RF Ceramic Chip Inductors
• RF Ceramic Chip Inductors
• Product Range Summary
• Mechanical Characteristics
• Inductance Range / Electrical Characteristics
• RF Characteristics
• Mechanical & Environmental Characteristics
• Typical Soldering Profile
• Taping Specifications
• Part Number Breakdown
• RF Wirewound Chip Inductors
• RF Wirewound Chip Inductors
• Product Range Summary
• Mechanical Characteristics
• Inductance Range / Electrical Characteristics
• RF Characteristics
• Mechanical & Environmental Characteristics
• Wirewound Inductor Packaging Information
• Part Number Breakdown
• S-Parameter Files
• Wirewound Inductor Cross Reference
• RF Wirewound Chip Inductor Soldering Profile

Prototype Kits:

• RF Ceramic Component ProtoTyping Kits
• RF Ceramic Component ProtoTyping Kits overview
• Capacitor and Inductor Designer Kits
  • Request a Prototyping Kit (L/C-201DL)
  • Request a Prototyping Kit (L/C-402DS)
  • Request a Prototyping Kit (L/C-603DS)
  • Request a Prototyping Kit (L/C-805DS)
• Capacitor Designer Kits
  • Request a Prototyping Kit (S201DL)
  • Request a Prototyping Kit (S402DS)
  • Request a Prototyping Kit(S603DS)
  • Request a Prototyping Kit (S805DS)
  • Request a Prototyping Kit (S111DVE)
• Inductor Designer Kits
  • Request a Prototyping Kit (L201DC)
  • Request a Prototyping Kit (L402DC)
  • Request a Prototyping Kit (L603DC)
• Tuning Capacitor Kits
  • Request a Prototyping Kit (S201TL)
  • Request a Prototyping Kit (S402TS)
  • Request a Prototyping Kit (S603TS)
  • Request a Prototyping Kit (S805TS)
  • Request a Prototyping Kit (S111TVE)
• Single Layer Capacitor Kits
  • Request a Prototyping Kit (GBBL)
• WireWound Inductor Kits
  • Request a Prototyping Kit (L402W)
  • Request a Prototyping Kit (L603W)
  • Request a Prototyping Kit (L805W)
• 2.45 Ghz Designer Kit for WLAN, Bluetooth, ISM and 802.11
  • Request a Prototyping Kit (2450L/C402D)
  • Request a Prototyping Kit (2450L/C603D)
• 5.5 Ghz Designer Kit for WLAN, Bluetooth, ISM and 802.11
  • Request a Prototyping Kit (5500L/C402D)
  • Request a Prototyping Kit (5500L/C603D)
• Designer Kit for WiMAX & UWB
  • Request a Prototyping Kit (WUWBL/C402D)
  • Request a Prototyping Kit (WUWBL/C603D)
• Non-Magnetic Capacitor Tuning Kit
  • Request a Prototyping Kit (S111DVE)
  • Request a Prototyping Kit (S603DS)
• Non-Magnetic Capacitor Designer Kit
  • Request a Prototyping Kit (S111DVE)
  • Request a Prototyping Kit (S603DS)

Integrated Passives:

• Integrated Passive Components (RoHS Compliant)
• Chipset Specific Baluns (RoHS Compliant)
• Ceramic Chip Antennas (RoHS Compliant)
• Ceramic Chip Antennas (RoHS Compliant)
• Available RF Antennas (RoHS Compliant)
• Available Antenna Switch Modules (RoHS Compliant)
• Available RF Baluns (RoHS Compliant)
• Available Balun Filter Combos (RoHS Compliant)
• Available Band Pass Filters (RoHS Compliant)
• Available Couplers (RoHS Compliant)
• Available Diplexers (RoHS Compliant)
• Available EMI Filter Arrays (RoHS Compliant)
• Available High Pass Filters (RoHS Compliant)
• Available Low Pass Filters (RoHS Compliant)
• Available Power Dividers (RoHS Compliant)
• Integrated Passives Part number Explanation
• Mechanical & Environmental Characteristics
• Typical Soldering Profile
• RF Component Tape & Reel Packaging
• Example Circuit Diagram
• Case Size Summary