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Inductor Tape & Reel Packaging
Inductor Tape & Reel Packaging
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RF Capacitors
High-Q Multi-Layer Capacitors (RoHS)
Overview & PDF
Available Capacitance Selection
Dielectric Characteristics
Mechanical Characteristics
Mechanical & Environmental Characteristics
Series Resonance Chart
RF Characteristics, EIA 0201
RF Characteristics, EIA 0402-0603
Graphical Data, EIA 1111-2525
Part Number Breakdown
EIA 1111 Capacitor Spec
LASERtrim®, RF Tuning
Overview & PDF
Model Selection
Tuning Description
RF Characteristics
Electrical Characteristics
Mechanical Characteristics
Part Number Breakdown
Single-Layer, Broadband Capacitors (GBBL)
Broadband Capacitor Overview
Dielectric Characteristics
Size & Capacitance Selection
Part Number Breakdown
Single-Layer, Microwave / Millimeterwave
Overview & PDF
Dielectric Characteristics
V & B-Series Capacitance Selection
V & B-Series Mechanical Characteristics
U-Series Standard Single Layer Capacitors
SLC Temperature Characteristics
Metalization Characteristics
Part Number Breakdown U, V, & B Series
Environmental Characteristics
Integrated Passives
Overview & PDF
Antenna Switch Modules
Ceramic Chip Antennas
Overview
Available RF Antennas
Baluns
Balun-Filter Combos
Band-Pass Filters
Chipset Specific Baluns
Couplers
Diplexers
EMI Filter Arrays
High Pass Filters
Low Pass Filters
Power Dividers
Mechanical & Environmental Characteristics
Typical Soldering Profile
Integrated Passive Tape & Reel Packaging
Example Circuit Diagram
Case Size Summary
RF Inductors
RF Ceramic Chip Inductors
Overview & PDF
Product Range Summary
Mechanical Characteristics
Inductance Range / Electrical Characteristics
RF Characteristics
Mechanical & Environmental Characteristics
Typical Soldering Profile
Packaging Information
Part Number Breakdown
RF WireWound Chip Inductors
Overview & PDF
Product Range Summary
Mechanical Characteristics
Inductance Range / Electrical Characteristics
RF Characteristics
Mechanical & Environmental Characteristics
Packaging Information
Part Number Breakdown
S-Parameter Files
Wirewound Inductor Cross Reference
RF Wirewound Capacitor Soldering Profile
Modules & Substrates
Custom LTCC Module Foundry Service
Custom Thin Film Metalized Substrates
Overview & PDF
Code Charts
Mechanical Characteristics
Part Number Breakdown
Application Specific
Overview & PDFs
WiMax Products [PDF]
UWB Products [PDF]
2.45 GHz Wifi Products [PDF]
5.5 GHz Wifi Products [PDF]
Wifi Dual Band Products [PDF]
GPS Products [PDF]
EMI Filter Array (LTCC) Products [PDF]
Automated Meter Reading [PDF]
900 MHz Solution [PDF]
GPS Antenna Application Products [PPS]
Legacy Product
C-Series High Frequency SMT MLCCs
Overview & PDF
Available Capacitance Selection
Mechanical Characteristics
Dielectric Characteristics
Mechanical & Environmental Characteristics
RF Characteristics
Part Number Breakdown
S-Parameter Files
Power-Q High Voltage RF MLCCs
Overview & PDF
Capacitance / Voltage Selection
Electrical Characteristics
Lead Style Selection
Part Number Breakdown
Porcelain Substitute NPO Ceramic Caps
Overview & PDF
Available Capacitance Selection
Dielectric Characteristics
Mechanical & Environmental Characteristics
RF Characteristics
Part Number Breakdown
Technical Notes
Overview
RoHS Compliance
Tape & Reel Packaging
Chip Capacitor Tape & Reel Packaging
RF Antenna Tape & Reel Packaging
RF Component Tape & Reel Packaging
Inductor Tape & Reel Packaging
RF Capacitors & Inductors
Storage and Solderability Checklist
Q & ESR Explained
SRF & PRF for RF Capacitors
Measuring S-Parameters of High-Q Caps
S-Parameter Accuracy
Capacitor Mounting & S-Parameters
Capacitor RF Current & Power
Trimming Characteristics of LASERtrim® Chip Caps
Dishal Bandpass Filter Tuning Using LASERtrim® Chip Caps
Reference Oscillator Tuning Using LASERtrim® Chip Caps
High Frequency Inductor Modeling Utilizing MLISoft®
Soldering Requirements for MLCC
Integrated Passives (RF Comp)
Chip Balun: Definitions & Measurement Methodology
Chip Antenna Layout Considerations for 802.11
JTI Chip Antenna Mounting and Tuning Techniques
2500AT43A0100 Frequency Tuning
Antenna Bandwidth Expansion Guide
AMR: Automated Meter Reading
T.I. CC2530/31 App Note
2450BM15A0002 Matched Balun for the Texas Instruments CC2530/31 ZigBee Transceiver
Prototyping Kits
Overview & PDF
Dual Capacitor and Inductor Designer Kits
Capacitor Designer Kits
Inductor Designer Kits
Tuning Capacitor Kits
Single Layer Capacitor Kits
WireWound Inductor Kits
2.45 Ghz Designer Kit for WLAN, Bluetooth, ISM and 802.11
5.5 Ghz Designer Kit for WLAN, Bluetooth, ISM and 802.11
Designer Kit for WiMAX & UWB
Cross Reference Charts
Capacitor Cross Reference
Monolithic Inductor Cross Reference
Wirewound Inductor Cross Reference
C-Series to S-Series Cross Reference
Modeling Software
JTIsoft® Overview
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Designer Libraries
Overview
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Modelithics Global Models
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RF Components
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Antenna Switch Modules
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Balun-Filters
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