These lines of Multi-Layer High-Q Capacitors, HiQ MLCC, HiQ Capacitors, SMT Capacitors, Low ESR Capacitors and Low Loss Capacitors have been developed for High-Q and microwave applications.

 

  RoHS compliance is standard for all unleaded parts.

Series Selection

Low Power

L-Series

Low Cost Mid-Q
0201 Multi Layer High-Q Capacitors low cost mid q

 

 

These capacitors give mid-high Q performance, and exhibit NP0 temperature characteristics.

Medium Power

S-Series

General Use High-Q
0402 0603 0805 multi layer high q capacitors

Ultra-high Q and low ESR performance with NPO characteristics.

High Power

E-Series

High Voltage RF - High Q
s42 s48 s58 multi layer high q capacitors

Excellent high-Q, low ESR and high RF power, from HF to microwave.

Series Resonance Chart
Series Resonance chart

 

Horizontal and Verticle Oriented Capacitors
Horizontal Electrode Orientation
Horizontal Electrode Orientation Multi-Layer High-Q Capacitors
Vertical Electrode Orientation
Vertical Electrode Orientation Multi-Layer High-Q Capacitors
Applications & Features
Size:
EIA 0201 to EIA 1111
Performance:
SRF’s up to 20 GHz, Ultra High Q, Tight tolerance, Ultralow ESR
Termination:
Ni/Au, Ni/Sn, Ni/SnPb
Applications:
High Frequency Wireless Communications, Portable Wireless Products, Battery Powered Products
Benifits of using Oriented Capacitors
  • Consistent Orientation - Improved repeatability of production circuits.
  • Consistent Orientation - More consistent filter performance.
  • Vertical Orientation - The elimination of parallel frequencies.
  • Vertical Orinetation - Lower inductance for a given capacitor
  • Horizontal Orientation - Lower coupling between adjacent capacitors.
Model Selection
EIA Size
/
Cap. Value
Miniature Size - Portable Electronics RF Power Applications
0201 (R05) 0201 (R05) 0402
(R07S)
0603
(R14S)
0805
(R15S)
0805
(R15G)
1111
(S42E)
2525
(S48E)
3838
(S58E)
NPO
(R05L)
NPO
(R05G)
pF Code   Voltage
0.1 0R1 A
B
C
D
                 
0.2 0R2 25V 25V200V250V    500V 1500V   
0.3 0R3 25V 25V200V250V250V 1000V 500V 1500V   
0.4 0R4 25V 25V200V250V250V 1000V 500V 1500V   
0.5 0R5 25V 25V200V250V250V 1000V 500V 1500V 2500V  
0.6 0R6 25V 25V200V250V250V 1000V 500V 1500V2500V 3600V 7200V
0.7 0R7 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
0.8 0R8 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
0.9 0R9 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
1.0 1R0 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
1.1 1R1 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
1.2 1R2 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
1.3 1R3 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
1.4 1R4 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
1.5 1R5 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
1.6 1R6 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
1.7 1R7 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
1.8 1R8 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
1.9 1R9 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
2.0 2R1 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
2.1 2R1 25V 25V 200V250V250V 1000V 500V 1500V2500V3600V7200V
2.2 2R2 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
2.4 2R4 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
2.7 2R7 25V 25V 200V250V250V 1000V 500V 1500V2500V3600V7200V
3.0 2R0 25V 25V 200V250V250V 1000V 500V 1500V2500V3600V7200V
3.3 3R3 25V 25V 200V 250V250V 1000V 500V 1500V2500V3600V7200V
3.6 3R6 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
3.9 3R9 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
4.3 4R3 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
4.7 4R7 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
5.1 5R1 A**
B
C
D
25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
5.6 5R6 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
6.2 6R2 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
6.8 6R8 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
7.5 7R5 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
8.2 8R2 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
9.1 9R1 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
10 100 F
G
J
K
25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
11 110 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
12 120 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
13 130 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
15 150 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
16 160 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
18 180 25V 25V200V250V250V 1000V 500V 1500V2500V3600V7200V
20 200 25V  200V250V250V 1000V 500V 1500V2500V3600V7200V
22 220 25V  200V250V250V 1000V 500V 1500V2500V3600V7200V
24 240 25V  200V250V250V 1000V 500V 1500V2500V3600V7200V
27 270 25V  200V250V250V 1000V 500V 1500V2500V3600V7200V
30 300 25V   50V 250V250V 1000V 500V 1500V2500V3600V7200V
33 330 25V   50V 250V250V 1000V 500V 1500V2500V3600V7200V
36 360 F
G
J
K
25V   250V250V 1000V 500V 1500V2500V3600V7200V
39 0R2 25V   250V250V 1000V 500V 1500V2500V3600V7200V
43 430 25V   250V250V 1000V 500V 1500V2500V3600V7200V
47 470 25V   250V250V 1000V 500V 1500V2500V3600V7200V
51 510 25V   250V250V 1000V 500V 1500V2500V3600V7200V
56 560 25V   250V250V 1000V 500V 1500V2500V3600V7200V
62 620 25V   250V250V 1000V 500V 1500V2500V3600V7200V
68 680 25V   250V250V 1000V 500V 1500V2500V3600V7200V
75 750 25V   250V250V 1000V 500V 1500V2500V3600V7200V
82 820 25V   250V250V 1000V 500V 1500V2500V3600V7200V
91 910 25V   250V250V 1000V 500V 1500V2500V3600V7200V
100 101 25V   250V250V 1000V 500V 1500V2500V3600V7200V
110 111      250V   300V 1500V2500V3600V7200V
120 121      250V   300V 1000V2500V3600V7200V
130 131      250V   300V 1000V2500V3600V7200V
150 151      250V   300V 1000V2500V3600V7200V
160 161      250V   300V 1000V2500V3600V7200V
180 181      250V   300V 1000V2500V3600V7200V
200 201      250V   300V 1000V2500V3600V 
220 221      250V   300V 1000V2500V3600V 
240 241          200V 1000V2500V3600V 
270 271          200V 1000V2500V 3600V 
300 301          200V 1000V 1500V 3600V 
330 331          200V 1000V1500V 3600V 
360 361          200V 1000V1500V 3600V 
390 391          200V500V1500V3600V 
430 431 G
J
K
         200V500V1500V2500V 
470 471          200V500V1500V2500V 
510 511          100V500V 1000V2500V 
560 561          100V500V1000V2500V 
620 621          100V500V1000V2500V 
680 681           50V 1000V2500V 
750 751          50V 1000V2500V 
820 821          50V 1000V2500V 
910 911          50V 1000V 1000V 
1000 102           50V 1000V1000V 
1200 122            1000V1000V 
1500 152             500V1000V 
1800 182             500V1000V 
2200 222              300V1000V 
2700 272             300V 500V 
3300 332             500V 
3900 392             500V 
4700 472              500V 
5100 512             500V 
10000 103                

 

Dielectric Characteristics
NPO
Temperature Coefficient: 0 ± 30ppm /°C, -55 to 125°C
Quality Factor / DF: Q >1,000 @ 1 MHz, Typical 10,000
Insulation Resistance: >10 GΩ @ 25°C,WVDC;
125°C IR is 10% of 25°C rating
Dielectric Strength: 2.5 X WVDC Min., 25°C, 50 mA max
Test Parameters: 1MHz ±50kHz, 1.0±0.2 VRMS, 25°C
Available Capacitance: Size 0201: 0.2 - 100 pF
Size 0402: 0.2 - 33 pF
Size 0603: 0.2 - 100 pF
Size 0805: 0.3 - 220 pF
Size 1111: 0.2 - 1000 pF
Size 2525: 0.5 - 2700 pF
Size 3838: 0.5 - 5100 pF
Mechanical Characteristics
SizeUnitsLengthWidthThicknessEnd Band
EIA 0201 In .024 ± .001 .012 ± .001 .012 ± .001 .008 Max.
Metric (0603) mm (0.60 ± 0.03) (0.30 ± 0.03) (0.30 ± 0.03) (0.20 Max.)
EIA 0402 In .040 ± .004 .020 ± .004 .020 ± .004 .010 ± .006
Metric (1005) mm (1.02 ± 0.1) (0.51 ± 0.1) (0.51 ± 0.1) (0.25 ± .15)
EIA 0603 In .062 ± .006 .032 ± .006 .030 + .005 /- .003 .014 ± .006
Metric (1608) mm (1.57 ± 0.15) (0.81 ± 0.15) (0.76 + .13 - .08) (0.35 ± .15)
EIA 0805 In .080 ± .008 .050 ± .008 .040 ± .006 .020 ± .010
Metric (2012) mm (2.03 ± 0.20) (1.27 ± 0.20) (1.02 ± .15) (0.50 ± .25)
Environmental Characteristics
Specification Test Paramaters
Solderability: Solder coverage ≥ 90% of metalized areas No termination degradation Preheat chip to 120°-150°C for 60 sec., dip terminals in rosin flux then dip in Sn62 solder @ 240°±5°C for 5±1 sec
Resistance to Soldering Heat : No mechanical damage
Capacitance change: ±2.5% or 0.25pF
Q>500 I.R. >10 G Ohms
Breakdown voltage: 2.5 x WVDC
Preheat device to 80°-100°C for 60 sec. followed by 150°-180°C for 60 sec. Dip in 260°±5°C solder for 10±1 sec. Measure after 24±2 hour cooling period
Terminal Adhesion: Termination should not pull off.
Ceramic should remain undamaged.
Linear pull force* exerted on axial leads soldered to each terminal.
*0402 ≥ 2.0lbs, 0603 ≥ 4.0lbs (min.)
PCB Deflection: No mechanical damage.
Capacitance change: 2% or 0.5pF Max
Glass epoxy PCB: 0.5 mm deflection
Vibration: No mechanical damage.
Capacitance change: ±2.5% or 0.25pF
Q>1000 I.R. ≥ 10 G-Ohm
Breakdown voltage: 2.5 x WVDC
Cycle performed for 2 hours in each of three perpendicular directions.
Frequency range 10Hz to 55 Hz to 10 Hz traversed in 1 minute. Harmonic motion amplitude: 1.5mm.
Humidity, Steady State: No mechanical damage. Capacitance change: ±5.0% or 0.50pF max.
Q>300 I.R. ≥ 1 G-Ohm
Breakdown voltage: 2.5 x WVDC
Relative humidity: 90-95%
Temperature: 40°±2°C
Test time: 500 +12/-0 Hours
Measure after 24±2 hour cooling period
Humidity, Low Voltage: No mechanical damage.
Capacitance change: ±5.0% or 0.50pF max.
Q>300 I.R. = 1 G-Ohm min.
Breakdown voltage: 2.5 x WVDC
Applied voltage: 1.5 VDC, 50 mA max.
Relative humidity: 85±2%
Temperature: 40°±2°C
Test time: 240 +12/-0 Hours
Measure after 24±2 hour cooling period
Thermal Cycle: No mechanical damage.
Capacitance change: ±2.5% or 0.25pF
Q>2000 I.R. >10 G Ohms
Breakdown voltage: 2.5 x WVDC
5 cycles of: 30±3 minutes @ -55°+0/-3°C,
2-3 min. @ 25°C, 30±3 min. @ +125°+3/-0°C,
2-3 min. @ 25°C
Measure after 24±2 hour cooling period
Life Test: MIL-STD-202, Method 1081 No mechanical damage.
Capacitance change: ±3.0% or 0.3 pF
Q>500 I.R. >1 G Ohms
Breakdown voltage: 2.5 x WVDC
Applied voltage: 200% of WDVC for capacitors rated at 500 volts DC or less.
Temperature: 125°±3°C
Test time: 1000+48-0 hours
Soldering Profiles and Guidelines for SMT Ceramic Components
General

Ceramic chip capacitors exhibit excellent reliability characteristics providing that proper circuit design techniques and controlled assembly processes are utilized. Due to the ceramic capacitor’s crystalline micro-structure these components are susceptible when exposed to excessive thermal or mechanical shock during circuit processing. It should be noted that micro-cracks in ceramic can be difficult to detect with normal post assembly visual and electrical testing and can pose a significant threat to reliable field operation. For this reason it is recommended that the assembly qualification process employ suitable testing to expose the presence of micro-cracking conditions.

Figure 1: Solder Reflow Profile for Ceramic Capacitors and Inductors (JEDEC J-STD-020C compatible)
Figure 1: Solder Reflow Profile for Ceramic Capacitors and Inductors (JEDEC J-STD-020C compatible)
Ceramic components’ leads composition and soldering compatibility

High Frequency Ceramic Capacitors & Inductors - Offered with standard tin plated nickel-barrier terminations compatible with solder flow and reflow processes.

Single Layer Capacitors - Offered with Titanium-Tungsten/Gold and Titanium-Tungsten/ Nickel/Gold thin-film termination as well as legacy Platinum/Palladium/Gold terminations.

LASERtrim® Capacitors - Offered with gold flashed nickel-barrier terminations only. Due to the unique internal construction of the LASERtrim® it is recommended that a conservative reflow temperature profile be used (Fig. 5). Wave soldering is discouraged.

Figure 2: Solder Flow Profile for Ceramic Capacitors and Inductors
Figure 2: Solder Flow Profile for Ceramic Capacitors and Inductors
Soldering Iron

Ceramic capacitor attachment with a soldering iron is discouraged due to the inherent limitations on precisely controlling soldering temperature, heat transfer rate, and time. In the event that a soldering iron must be employed the following precautions are recommended.

  • Preheat circuit and ceramic component to 150°C
  • ever contact the ceramic surface with the iron tip
  • 30 watt iron output (max)
  • 280°C tip temperature (max)
  • 3.0 mm tip diameter (max)
  • Limit soldering time to 5 sec.
Figure 3: Vapor Phase Profile for MLCCs
Figure 3: Vapor Phase Profile for MLCCs
Solder Pre-Heat Cycle

Proper preheating is essential to prevent thermal shock cracking of the capacitor. The circuit assembly should be preheated as shown in the recommended profiles at a rate of 1.0 to 2.0°C per second to within 65 to 100°C of the maximum soldering temperature.

  • Preheat circuit and ceramic component to 150°C
  • ever contact the ceramic surface with the iron tip
  • 30 watt iron output (max)
  • 280°C tip temperature (max)
  • 3.0 mm tip diameter (max)
  • Limit soldering time to 5 sec.
Figure 4: Wave Solder Profile for MLCCs
Figure 4: Wave Solder Profile for MLCCs
SMT Soldering Temperatures

Solders typically utilized in SMT have melting points between 179°C and 188°C. Activation of rosin fluxes occurs at about 200°C. Based on these facts a minimum peak reflow temperature of 205°C to 210°C should be established. A maximum peak reflow temperature of 225°C should be adequate in most circumstances. Many reflow process profiles have peaks ranging from 240°C to 260°C and while ceramic capacitors and inductors can withstand soldering temperatures in this range for short durations they should be minimized or avoided whenever possible. Use of PCB mounted multiple thermocouple M.O.L.E. profiling is advised for accurate characterization of circuit heat absorption and maximum temperature conditions.

Figure 5: Solder Reflow Profile for LASERtrims
Figure 5: Solder Reflow Profile for LASERtrims®
Reflow Solder

The general term “reflow” refers to several methods used in heating the circuit so that solder paste reflows, or “wetting” of the ceramic capacitor and PCB contacts occurs. These methods include infrared, convection and radiant heating. The size of the solder fillet may be controlled by varying the amount of solder paste that is screened onto the circuit. Recommended temperature limits and times for solder reflow are shown in Figure 1 and 2 for Ceramic Capacitors and inductors and for LASERtrim® in Figure 5.

Vapor Phase

A typical vapor phase soldering process consists of several temperature zones created by saturated vapor from a boiling liquid. As the circuit passes through the zone the vapor condenses on the solder paste, pad, and termination resulting in heat transfer and reflow of the solder paste. Vapor phase reflow produces consistent circuit heating with reflow occurring at a relatively lower temperature that is determined by the known boiling point of the liquid used, typically 215°C. Recommended temperature limits for vapor phase reflow are shown in Figure 3.

Figure 6 for LASERtrims
Figure 6
Solder Wave

Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit as it is immersed in the molten solder wave, typically at 240°C. Recommended temperature limits for wave soldering are shown in Fig. 4.

Cool Down Cycle

After the solder reflows properly the assembly should be allowed to cool gradually at room ambient conditions. Attempts to speed this cooling process or immediate exposure of the circuit to cold cleaning solutions may result in thermal shock cracking of the ceramic capacitor.

Solder Fillets

To avoid detrimental effects of thermal and mechanical stress it is essential that the solder fillet be limited to 2/3rds of the overall height of the MLC termination as illustrated in the figure below. The solder fillet can be controlled by solder paste deposition and pad design in reflow and vapor phase processes and by pad design and use of hot air knives in the wave process. As shown in Figure 6.

Tomb Stoning/Chip Movement

Tomb-stoning or draw bridging is illustrated in the figure below. Tomb-stoning or other undesirable chip movements may result if unequal surface tension forces exist as the molten solder wets the MLC terminations and mounting pads. This tendency can be minimized by insuring that all factors at both solder joints are equal, namely; pad size, solder mass, termination size, component position and heating. Tomb-stoning is easily avoided through proper design, material selection and proofing of the process. As shown in figure 7.

Figure 7 MLC Chip Movement
Figure 7

 

Chip Capacitor Tape & Reel Packaging

Johanson capacitors are available taped per EIA standard 481. Tape options include 5", 7" and 13" diameter reels. Johanson uses high quality, dust free, punched 8mm paper tape and plastic embossed 8mm tape for thicker MLCs. Quantity per reel ranges are listed in the tables below and are dependent on chip thickness.

Image of a Johanson Tape Reel
Image of a Johanson embossed and paper Tape close up Image of a Johanson embossed and paper Tape close up 4mm apart Image of a Johanson embossed and paper Tape close up 8mm apart

 

5” DIA. REEL SIZE7” DIA. REEL SIZE13” DIA. REEL SIZE
TYPE / SIZEREEL QUANTITYTAPE TYPETAPE CODEREEL QUANTITYTAPE TYPETAPE CODEREEL QUANTITYTAPE TYPETAPE CODE
R05 / 0201 500 PaperY 15,000 PaperT N/A N/A N/A
R07 / 0402 500PaperY 10,000 PaperT N/A N/A N/A
R14 / 0603 500PaperY 4,000 PaperT 10,000 Paper R
R15 / 0805500 Embossed Z 4,000 Embossed E 10,000 Embossed U
S42 / 1111500 Embossed Z 2,000 Embossed E 10,000 Embossed U
S48 / 2525 N/A 250 Embossed E 1,000 Embossed U
S58 / 3838 N/A 250 Embossed E 1,000 Embossed U
LASERtrim® (All)500PaperY 4.5-5.0K PaperT 15,000 Paper R
SUBSTRATES – DEPENDS ON SIZE, TYPICAL IS 10/BOX CAP ARRAYS - 100/TRAY
SINGLE LAYER CAPACITORS - UP TO 50 MIL, 400/WAFFLE PACK; > 50 MIL, 100/WAFFLE PACK
SLC’S CAN ALSO BE MOUNTED ON GRIP RINGS, RING FRAMES, AND SURFTAPE
CUSTOM PACKAGING AND QUANTITIES ARE AVAILABLE, CONTACT THE FACTORY FOR OPTIONS
PLEASE VISIT OUR WEB SITE FOR RF CERAMIC COMPONENT PACKAGING INFORMATION.
How to Order
Multi-layer High Q capacitor how to order part number