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| Overview: |
| Johanson Technology has the capability to produce a wide range of application specific components for wireless communication such as Diplexer Switch, VCO, PA and highly integrated RF modules using LTCC (Low Temperature Co-fired Ceramic) technology. We offer extensive expertise using DuPont, Ferro and internally developed LTCC tape systems. |
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| Design Rules |
Standard (mm) |
Advanced (mm) |
| (A) Via Hole Dia |
0.125, 0.18 |
0.06 (min) |
| (B) Via Cover Dot Dia |
>= Via + 0.03 |
Via + 0.02 |
| (C) Via Center Spacing |
>= 0.20 (for 0.07 via) |
0.18 (for 0.05 via) |
| (D) Via Cover Dot Edge to Line Edge |
> 0.10 |
> 0.08 |
| (E) Line Width |
>= 0.10 |
>= 0.05 |
| (F) Line to Line Spacing |
>= 0.10 |
>= 0.08 |
| (G) Line Center Spacing |
>= 0.18 |
>= 0.13 |
| (H) Outside Edge to Via Center |
>= 0.15 |
>= 0.135 |
| (I) Line Over Outside Edge for Cutting |
>= 0.05 |
>= 0.05 |
| (J) Outside Edge to Line Clearance |
>= 0.10 |
>= 0.10 |
| (M) Buried Ground Plane Spacing |
>= 0.10 |
>= 0.10 |
| (N) Feed Thru Spacing |
>= 0.15 |
>= 0.10 |
| Substrate Thickness |
0.5 to 1.6 |
0.3 to 2.4 |
| Number of Layers |
Up to 20 |
Up to 30 |
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| LTCC Tape Characteristics |
JTI |
| Dielectric Constant (@ 3GHz) |
7.5 |
| Dielectric Loss (@ 3GHz) |
0.33% |
| TCE (25-300°C) (ppm/°C) |
4.7 |
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