| |
Specification |
Test Parameters |
| Solderability: |
Solder coverage 90% of metalized areas. |
Preheat chip to 120°-150°C
for 60 sec. Dip terminals in rosin flux then dip
in 62Sn/36Pb/2Ag solder @ 240±5°C
Dip time = 5±1 sec. |
| Resistance to Soldering Heat: |
Chip should not crack.
Solder coverage 80%
|
Preheat chip to 120¡-150¡C for 60
sec. Dip terminals in rosin flux then dip in 62Sn/36Pb/2Ag
solder @ 260±5°C
Dip time = 10±1 sec. |
| Terminal Adhesion: |
Termination should not pull off.
Ceramic should remain undamaged. |
Linear pull force exerted on axial leads soldered
to each terminal. Terminal strength: 2.0Lbs for
0402, 2.0Lbs for 0603, 5.0Lbs for 0805 |
| PCB Deflection: |
No mechanical damage.
Cap. change: 2% or .5pF Max |
Glass Epoxy PCB: 1 mm deflection |
| Life Test: |
Cap. change: 2% or .5pF Max
I.R. = Initial value |
1000 Hours, 125°C, 200% rated voltage |
| Thermal Shock: |
Cap. change: 2% or .5pF Max
I.R. = 70% of initial value |
5 CYCLES: 30±3 minutes @ -55°C, 3 min.
@ 25°C, 30±3 min. @ +125°C, 3 min.
@ 25°C |
| Moisture Resistance: |
Cap. change: 2% or .5pF Max
I.R. = 70% of initial value |
240 Hours, 85% Relative Humidity, 85°C, 1.5
VDC |
