| |
Requirements |
Procedure |
| Solderability: |
No apparent damage.
More than 75% of the terminal electrode shall be covered with new solder |
Preheat : 120 ± 5°C
Solder : 230 ± 5°C for 5 ± 1 sec |
Thermal Shock:
(Temperature Cycle) |
No apparent damage.
Fulfill the electrical specification after test. |
One cycle/step 1: 85 ± 5°C for 20sec
One cycle/step 2: -40 ± 3°C for 20sec
Cycle time:30min
No. of cycles:100
Recovery: 1-2hrs |
| Heat Resistance: |
No apparent damage.
Fulfill the electrical specification after test. |
Temperature : 85 ± 2°C
Duration : 24 ± 2 hrs
Recovery : 1-2hrs |
| Low Temperature Resistance: |
No apparent damage.
Fulfill the electrical specification after test. |
Temperature : -40 ± 5°C
Duration : 24 ± 2 hrs
Recovery : 1-2hrs |
| Humidity Resistance: |
No apparent damage.
Fulfill the electrical specification after test. |
Temperature : 85 ± 2°C
Humidity : 80 ~ 85% RH
Duration : 1000 ± 48 hrs
Recovery : 1-2hrs |
| Drop Shock: |
No apparent damage. |
Dropped onto hard wood from height of 50 cm for 3 times ; each x,y and z direction except terminal direction |
