Wire / Ribbon Bonding Pb/Sn or
Silver or Gold Conductive Epoxy
Au/Ge or Au/Si Eutectic Preform
Excellent High Temperature Resistance (400°C)
Unsuitable for Pb/Sn or Au/Sn Soldering
Au/Sn Soldering
Au/Sn Eutectic Preform
Moderate High Temp. Resistance (325°C)
Long term high temperature may cause Ni diffusion and wire bond problems on Au/Ge
SLC thick-film terminations ( legacy codes “G” and “9”) are still supported. Contact the factory for compatibility information.
