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Metallization Characteristics

Metallization Type TiW/Au (Titanium-Tungsten/Gold) TiW/Ni/Au (Titanium-Tungsten/Nickel/Gold)
Termination Code T N
Attachment Compatibility Wire / Ribbon Bonding
Silver or Gold Conductive Epoxy
Au/Ge or Au/Si Eutectic Preform
Excellent High Temperature Resistance (400°C)
Unsuitable for Pb/Sn or Au/Sn Soldering
Pb/Sn or Au/Sn Soldering
Au/Sn Eutectic Preform
Moderate High Temp. Resistance (325°C)
Long term high temperature may cause Ni diffusion and wire bond problems on Au/Ge

SLC thick-film terminations ( legacy codes "G" and "9") are still supported. Contact the factory for compatibility information.

 

 
 

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