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Mechanical & Environmental Characteristics

Specification Test Parameters
Solderability: Solder coverage ≥ 75% of electrodes L = ± 10% Q = ±20% Preheat 120±20°C for 1 min. Dip 230±10°C for 3±1 sec.
Resistance to soldering: No apparent damage Solder coverage ≥ 75% L = ± 10% Q = ± 20% Preheat 120±20°C for 1 min. Dip 260±10°C for 10±1 sec.
Thermal Shock: No apparent damage L = ± 10% Q = ± 20% 100 cycles: 30±3 minutes @+100°C then 30±3 min. @ -40°C
Life Test: No apparent damage L = ± 10% Q = ± 20% 1000 ±48 Hours @ +85±2°C, rated current (1-2 hour recovery)
Humidity Resistance: Inductance change 2% or .5pF Max 1000 ±48 Hours @ +40±2°C, 90 - 95% relative humidity. Rated current (1-2 hour recovery)
Terminal Adhesion:: Termination should not pull off.
Ceramic should remain undamaged.
Lateral pull force. 0201 ≥ 1.0Lbs 0402 ≥ 1.6Lbs For 0603 ≥ 2.2Lbs For 0805 ≥ 4.4Lbs
PCD Deflection: No mechanical damage. Glass Epoxy PCB: 1mm deflections

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