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RF Wirewound Chip Inductor Soldering Profile

Temperate Profile

a) Reflow temperature profile (Temperature of the mounted parts surface on the printed circuit board)
Reflow Temperature Profile Recommended Peak Temperature: 250°C Max
250°C up / within 10secs
Max. Reflow temperature: 260°C
Gradient of temperature rise: av 1-4°C/sec
Preheat: 160-190°C / within 90 - 120 secs
220°C up / within 30-60 secs
Composition of solder Sn-3Ag-0.5Cu



b) Dip Temperature
Dip Temperature Solder bathtub temperature: 260°C max within 5 secs
Preheating temperature 100 - 130°C deposit solder temperature
Composition of solder Sn-3Ag-0.5Cu



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