Login     Register

RF Wirewound Chip Inductor Soldering Profile

Temperate Profile

a) Reflow temperature profile (Temperature of the mounted parts surface on the printed circuit board)
Reflow Temperature Profile Recommended Peak Temperature: 250°C Max
250°C up / within 10secs
Max. Reflow temperature: 260°C
Gradient of temperature rise: av 1-4°C/sec
Preheat: 160-190°C / within 90 - 120 secs
220°C up / within 30-60 secs
Composition of solder Sn-3Ag-0.5Cu

 

 

b) Dip Temperature
Dip Temperature Solder bathtub temperature: 260°C max within 5 secs
Preheating temperature 100 - 130°C deposit solder temperature
Composition of solder Sn-3Ag-0.5Cu

 

<< Return to RF Wirewound Chip Inductors Overview
 
 

Part Locator
  • Part Number Search
  • RF Components
Sales Reps
Distributors
Corporate Responsibility
Prototyping Kits
Cross Reference Charts
Designer Libraries
Modeling Software
Johanson Technology, Inc.

4001 Calle Tecate
Camarillo, CA 93012

(805) 389-1166 phone
(805) 389-1821 fax
Copyright © 2014 Johanson Technology
All rights reserved.