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Thursday, May 15th, 2008
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RF Capacitors
High-Q Multi-Layer Capacitors (RoHS)
Overview & PDF
Available Capacitance Selection
Dielectric Characteristics
Mechanical Characteristics
Mechanical & Environmental Characteristics
Lead Style Selection, EIA 1111-3838
Series Resonance Chart
RF Characteristics, EIA 0201
RF Characteristics, EIA 0402-0603
Graphical Data, EIA 1111-2525
Part Number Breakdown
Save to Cart (for Requests/Orders)
LASERtrim®, RF Tuning
Overview & PDF
Model Selection
Tuning Description
RF Characteristics
Electrical Characteristics
Mechanical Characteristics
Part Number Breakdown
Save to Cart (for Requests/Orders)
Single-Layer, Broadband (GBBL)
Overview & PDF
Dielectric Characteristics
Size & Capacitance Selection
Part Number Breakdown
Save to Cart (for Requests/Orders)
Single-Layer, Microwave/Millimeterwave
Overview & PDF
Dielectric Characteristics
V & B-Series Capacitance Selection
V & B-Series Mechanical Characteristics
U-Series Standard Single Layer Capacitors
SLC Temperature Characteristics
Metalization Characteristics
Environmental Characteristics
Part Number Breakdown U, V, & B Series
Save to Cart (for Requests/Orders)
Integrated Passives
Overview & PDF
Antennas, Chip (RoHS)
Baluns (RoHS)
Balun-Filter Combos (RoHS)
Band-Pass Filters, 2.45 GHz (RoHS)
Band-Pass Filters, 5.5 GHz (RoHS)
Band-Pass Filters, Other (RoHS)
Couplers (RoHS)
Diplexers (RoHS)
EMI Filter Arrays (RoHS)
High Pass Filters (RoHS)
Low Pass Filters (RoHS)
Mechanical & Environmental Characteristics
Typical Soldering Profile
Integrated Passive Tape & Reel Packaging
RF Inductors
RF Ceramic Chip Inductors
Overview & PDF
Product Range Summary
Mechanical Characteristics
Inductance Range / Electrical Characteristics
RF Characteristics
Mechanical & Environmental Characteristics
Typical Soldering Profile
Packaging Information
Part Number Breakdown
Save to Cart (for Requests/Orders)
RF WireWound Chip Inductors
Overview & PDF
Product Range Summary
Mechanical Characteristics
Inductance Range / Electrical Characteristics
RF Characteristics
Mechanical & Environmental Characteristics
Packaging Information
Part Number Breakdown
Save to Cart (for Requests/Orders)
Modules & Substrates
Custom LTCC Module Foundry Service
Custom Thin Film Metalized Substrates
Overview & PDF
Code Charts
Mechanical Characteristics
Part Number Breakdown
Application Specific
Overview & PDFs
Legacy Product
C-Series High Frequency SMT MLCCs
Overview & PDF
Available Capacitance Selection
Mechanical Characteristics
Dielectric Characteristics
Mechanical & Environmental Characteristics
RF Characteristics
Part Number Breakdown
Save to Cart (for Requests/Orders)
Power-Q High Voltage RF MLCCs
Overview & PDF
Capacitance / Voltage Selection
Electrical Characteristics
Lead Style Selection
Part Number Breakdown
Save to Cart (for Requests/Orders)
Porcelain Substitute NPO Ceramic Caps
Overview & PDF
Available Capacitance Selection
Dielectric Characteristics
Mechanical & Environmental Characteristics
RF Characteristics
Part Number Breakdown
Save to Cart (for Requests/Orders)
Technical Notes
Overview
RoHS Compliance
Tape & Reel Packaging
Chip Capacitor Tape & Reel Packaging
RF Antenna Tape & Reel Packaging
RF Component Tape & Reel Packaging
Inductor Tape & Reel Packaging
RF Capacitors & Inductors
Storage and Solderability Checklist
Q & ESR Explained
SRF & PRF for RF Capacitors
Measuring S-Parameters of High-Q Caps
S-Parameter Accuracy
Capacitor Mounting & S-Parameters
Capacitor RF Current & Power
Trimming Characteristics of LASERtrim® Chip Caps
Dishal Bandpass Filter Tuning Using LASERtrim® Chip Caps
Reference Oscillator Tuning Using LASERtrim® Chip Caps
High Frequency Inductor Modeling Utilizing MLISoft®
Soldering Requirements for MLCC
Integrated Passives (RF Comp)
Chip Balun: Definitions & Measurement Methodology
Chip Antenna Layout Considerations for 802.11
Prototyping Kits
Overview & PDF
Capacitor and Inductor Designer Kits
(Individual) Capacitor and Inductor Designer Kits
Tuning Capacitor Kits
Single Layer Capacitor Kits
WireWound Inductor Kits
2.45 Ghz Designer Kit for WLAN, Bluetooth, ISM and 802.11
5.5 Ghz Designer Kit for WLAN, Bluetooth, ISM and 802.11
Cross Reference Charts
Capacitor Cross Reference
Monolithic Inductor Cross Reference
Wirewound Inductor Cross Reference
C-Series to S-Series Cross Reference
Modeling Software
JTIsoft® Overview
Detailed Information
Screenshots
Download
Designer Libraries
Overview
Agilent ADS Libraries
AWR MWO Libraries
Eagleware Genesys Libraries
Modelithics Global Models
Part Number Search
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0805
1111
1206
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3838
4035
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10000
pF/nH
RF Components
Select a Component Type
Antennas
Balun-Filters
Baluns
Baluns, Dual Band
Baluns, Matching
Band Pass Filters, 2.45 GHz
Band Pass Filters, 5.5 GHz
Band Pass Filters, Other
Couplers
Couplers w/ LP Filters
Couplers (2xBand, 1xPath)
Couplers (2xBand, 2xPath)
Couplers (Splitter)
Diplexers (LPF/HPF type)
Diplexers (LPF/BPF type)
Diplexers (Harmonic Rej.)
EMI Filter Arrays
High Pass Filters
Low Pass Filters
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Product Information:
Product Information
S-Series Ultra-Low ESR SMT MLCCs
C-Series High Frequency SMT MLCCs
L-Series & X7R SMT MLCCs
E-Series Power Q MLCC
RF Ceramic Chip Inductors
RF Wirewound Chip Inductors
RF Components (Filters, Baluns, Couplers & Diplexers)
Custom LTCC Module Foundry Service
LASERtrim® RF Tuning Capacitors
Broadband Single Layer Capacitor (GBBL)
Single Layer Microwave Capacitors
Custom Thin Film Metalized Substrates
Porcelain Substitute – NPO Ceramic Capacitors
Power-Q High Voltage RF Capacitors
Chip Antennas
Technical Notes
Q & ESR Explained
SRF & PRF for RF Capacitors
Measuring S-Parameters of High-Q Caps
S-Parameter Accuracy
Capacitor Mounting & S-Parameters
Capacitor RF Current & Power
Trimming Characteristics of LASERtrim® Chip Caps
Dishal Bandpass Filter Tuning Using LASERtrim® Chip Caps
Reference Oscillator Tuning Using LASERtrim® Chip Caps
High Frequency Inductor Modeling Utilizing MLISoft®
Soldering Requirements for MLCC
Chip Balun: Definitions & Measurement Methodology
Chip Capacitor Tape & Reel Packaging
RF Antenna Tape & Reel Packaging
RF Component Tape & Reel Packaging
Chip Antenna Layout Considerations for 802.11 Applications
Prototyping Kits
Capacitor and Inductor Designer Kits
Tuning Capacitor Kits
Wirewound Inductor Kits
Single Layer Capacitor Kits
2.45 Ghz Designer Kit for WLAN, Bluetooth, ISM and 802.11
5.5 Ghz Designer Kit for WLAN, Bluetooth, ISM and 802.11
Cross Reference Charts
Capacitor Cross Reference
Monolithic Inductor Cross Reference
Wirewound Inductor Cross Reference
Modeling Software
Overview
Information compiled
Screen Shots
Download
Product Information:
Products
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Technical Notes
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Prototyping Kits
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Cross Reference Charts
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Modeling Software
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Designer Libraries
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Johanson Technology, Inc.
4001 Calle Tecate
Camarillo, CA 93012
(805) 389-1166 phone
(805) 389-1821 fax
