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Technical Notes
Integrated Passives (RF Comp)
Recommended Storage Conditions
Recommended Storage Conditions
The general optimum recommendations for Ni/Sn termination IPC are:
Temperature from +5C to +35°C
Relative Humidity: 45~75%
18 mos. Max
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Product Catalog
RF Capacitors
High-Q Multi-Layer Capacitors (RoHS)
Available Capacitance Selection
01005 (R03S)
R03S Information
0201 (R05L - NP0)
R05L Information
0201 (R05W - X7R)
R05W Information
0402 (R07S)
R07S Information
0603 (R14S)
R14S Information
0805 (R15S)
R15S Information
1111 (S42E)
S42E Information
2525 (S48E)
S48E Information
3838 (S58E)
S58E information
EIA 0201 Oriented Capacitors
Dielectric Characteristics
EIA 1111 Capacitor Spec
E-Series Termination and Leads, EIA 1111 - 3838
Graphical Data, EIA 1111-2525
Mechanical Characteristics
Mechanical & Environmental Characteristics
Part Number Breakdown
PCB Pad Layout Recommendations
Overview & PDF
RF Characteristics, EIA 0201
RF Characteristics, EIA 0402-0603
Series Resonance Chart
Soldering Requirements and Profile
LASERtrim®, RF Tuning
Electrical Characteristics
Mechanical Characteristics
Model Selection
Overview & PDF
RF Characteristics
Part Number Breakdown
Tuning Description
Single-Layer, Broadband Capacitors (GBBL)
Broadband Capacitor Overview
Dielectric Characteristics
Part Number Breakdown
Size & Capacitance Selection
Single-Layer, Microwave / Millimeterwave
Dielectric Characteristics
Environmental Characteristics
Metalization Characteristics
Overview & PDF
Part Number Breakdown U, V, & B Series
SLC Temperature Characteristics
U-Series Standard Single Layer Capacitors
V & B-Series Capacitance Selection
V & B-Series Mechanical Characteristics
Integrated Passives
Overview & PDF
More Info
Example Circuit Diagram
Integrated Passive Tape & Reel Packaging
Int. Passives Part Number Explanation
Mechanical & Environmental Characteristics
Silver Leaded Components' Storage and Soldering Profile
Typical Soldering Profile
Obsolete Integrated Passives
Antennas
Antenna Switch Modules
Baluns
Balun-Filter Combos
Band-Pass Filters
Case Size Summary
Chipset Specific RF Front-End Integrated Passive Components
Analog Devices
Atmel
California Eastern Labs (CEL)
Cambridge Silicon Radio (CSR)
Infineon/Intel
MediaTek (MTK)
Nordic Semiconductor
ST Microelectronics
Texas Instruments (TI)
Qualcomm-Atheros
Couplers/Coupler-Filt/Hyb-Couplers
Diplexers
EMI Filter Arrays
High Pass Filters
Low Pass Filters
Power Dividers
RF Inductors
RF Ceramic Chip Inductors
Inductance Range / Electrical Characteristics
Mechanical Characteristics
Mechanical & Environmental Characteristics
Overview & PDF
Packaging Information
Part Number Breakdown
Product Range Summary
RF Characteristics
Typical Soldering Profile
PCB Pad Layout Recommendations
RF WireWound Chip Inductors
Inductance Range / Electrical Characteristics
Mechanical Characteristics
Mechanical & Environmental Characteristics
Overview & PDF
Packaging Information
Part Number Breakdown
Product Range Summary
RF Characteristics
RF Wirewound Capacitor Soldering Profile
S-Parameter Files
Wirewound Inductor Cross Reference
Modules & Substrates
Custom LTCC Module Foundry Service
Custom Thin Film Metalized Substrates
Code Charts
Mechanical Characteristics
Overview & PDF
Part Number Breakdown
Application Specific
AMR: Automated Meter Reading
Automated Meter Reading [PDF]
EMI Filter Array (LTCC) Products [PDF]
Johanson GPS Solutions (PPT)
Overview & PDFs
UWB Products [PDF]
WiMax Products [PDF]
Wifi Dual Band Products [PDF]
2.45 GHz Wifi Products [PDF]
5.5 GHz Wifi Products [PDF]
900 MHz Solution [PDF]
Legacy Product (Obsolete)
C-Series High Frequency SMT MLCCs
Capacitance Selection
Dielectric Characteristics
Mechanical Characteristics
Mechanical & Environmental Characteristics
Overview & PDF
Part Number Breakdown
RF Characteristics
S-Parameter Files
Power-Q High Voltage RF MLCCs
Capacitance / Voltage Selection
Electrical Characteristics
Lead Style Selection
Overview & PDF
Part Number Breakdown
Porcelain Substitute NPO Ceramic Caps
Capacitance Selection
Dielectric Characteristics
Mechanical & Environmental Characteristics
Overview & PDF
Part Number Breakdown
RF Characteristics
Obsolete Integrated Passives
Technical Notes
Overview
MSL Rating
RoHS Compliance
Tape & Reel Packaging
Chip Capacitor Tape & Reel Packaging
Inductor Tape & Reel Packaging
RF Antenna Tape & Reel Packaging
RF Component Tape & Reel Packaging
RF Capacitors & Inductors
EIA 0201 Oriented Capacitors
Capacitor Mounting & S-Parameters
Capacitor RF Current & Power
Dishal Bandpass Filter Tuning Using LASERtrim® Chip Caps
High Frequency Inductor Modeling Utilizing MLISoft®
Measuring S-Parameters of High-Q Caps
Q & ESR Explained
Reference Oscillator Tuning Using LASERtrim® Chip Caps
S-Parameter Accuracy
SRF & PRF for RF Capacitors
Storage and Solderability Checklist
Trimming Characteristics of LASERtrim® Chip Caps
Inductor Orientation Marking Benefits (RF Study)
Soldering Profiles and Guidelines for SMT Ceramic Components
Integrated Passives (RF Comp)
433mhz Antenna Tech Note
Antenna Bandwidth Expansion Guide
Chip Antenna Layout Considerations for 802.11
Chip Balun: Definitions & Measurement Methodology
JTI Chip Antenna Mounting and Tuning Techniques
Silver Leaded Components' Storage and Soldering Profile
2500AT43A0100 Frequency Tuning
2450BM14A0002 Matched Balun for Nordic nRF24L01/nRF24L01+
2450BM15A0002 AppNote
783/868/915/953/2450MHz Single Antenna Pattern
Simulate Johanson Technology Baluns in GENESYS 2009.04
Recommended Storage Conditions
2450BM15A0015_125TempTest
Export Control Classification Number
Prototyping Kits
Capacitor Designer Kits
Designer Kit for WiMAX & UWB
Dual Capacitor and Inductor Designer Kits
Inductor Designer Kits
Non-Magnetic Capacitor Designer Kit
Non-Magnetic Capacitor Tuning Kit
Overview & PDF
Single Layer Capacitor Kits
Tuning Capacitor Kits
WireWound Inductor Designer Kits
2.45 Ghz Designer Kit for WLAN, Bluetooth, ISM and 802.11
5.5 Ghz Designer Kit for WLAN, Bluetooth, ISM and 802.11
Cross Reference Charts
Capacitor Cross Reference
C-Series to S-Series Cross Reference
Monolithic Inductor Cross Reference
Wirewound Inductor Cross Reference
Modeling Software
Download
JTIsoft® Overview
Agilent AppCAD
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Overview
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RF Components
Antenna Switch Module
Antenna
Balun-Filter
Baluns
Band Pass Filter
Couplers
Chipset Specific Baluns
Diplexers
EMI Filter Array
High Pass Filter
Low Pass Filter
Power Dividers
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Johanson Technology, Inc.
4001 Calle Tecate
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