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Friday, May 9th, 2008
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RF Capacitors
High-Q Multi-Layer Capacitors (RoHS)
Overview & PDF
Available Capacitance Selection
Dielectric Characteristics
Mechanical Characteristics
Mechanical & Environmental Characteristics
Lead Style Selection, EIA 1111-3838
Series Resonance Chart
RF Characteristics, EIA 0201
RF Characteristics, EIA 0402-0603
Graphical Data, EIA 1111-2525
Part Number Breakdown
Save to Cart (for Requests/Orders)
LASERtrim®, RF Tuning
Overview & PDF
Model Selection
Tuning Description
RF Characteristics
Electrical Characteristics
Mechanical Characteristics
Part Number Breakdown
Save to Cart (for Requests/Orders)
Single-Layer, Broadband (GBBL)
Overview & PDF
Dielectric Characteristics
Size & Capacitance Selection
Part Number Breakdown
Save to Cart (for Requests/Orders)
Single-Layer, Microwave/Millimeterwave
Overview & PDF
Dielectric Characteristics
V & B-Series Capacitance Selection
V & B-Series Mechanical Characteristics
U-Series Standard Single Layer Capacitors
SLC Temperature Characteristics
Metalization Characteristics
Environmental Characteristics
Part Number Breakdown U, V, & B Series
Save to Cart (for Requests/Orders)
Integrated Passives
Overview & PDF
Antennas, Chip (RoHS)
Baluns (RoHS)
Balun-Filter Combos (RoHS)
Band-Pass Filters, 2.45 GHz (RoHS)
Band-Pass Filters, 5.5 GHz (RoHS)
Band-Pass Filters, Other (RoHS)
Couplers (RoHS)
Diplexers (RoHS)
EMI Filter Arrays (RoHS)
High Pass Filters (RoHS)
Low Pass Filters (RoHS)
Mechanical & Environmental Characteristics
Typical Soldering Profile
Integrated Passive Tape & Reel Packaging
RF Inductors
RF Ceramic Chip Inductors
Overview & PDF
Product Range Summary
Mechanical Characteristics
Inductance Range / Electrical Characteristics
RF Characteristics
Mechanical & Environmental Characteristics
Typical Soldering Profile
Packaging Information
Part Number Breakdown
Save to Cart (for Requests/Orders)
RF WireWound Chip Inductors
Overview & PDF
Product Range Summary
Mechanical Characteristics
Inductance Range / Electrical Characteristics
RF Characteristics
Mechanical & Environmental Characteristics
Packaging Information
Part Number Breakdown
Save to Cart (for Requests/Orders)
Modules & Substrates
Custom LTCC Module Foundry Service
Custom Thin Film Metalized Substrates
Overview & PDF
Code Charts
Mechanical Characteristics
Part Number Breakdown
Application Specific
Overview & PDFs
Legacy Product
C-Series High Frequency SMT MLCCs
Overview & PDF
Available Capacitance Selection
Mechanical Characteristics
Dielectric Characteristics
Mechanical & Environmental Characteristics
RF Characteristics
Part Number Breakdown
Save to Cart (for Requests/Orders)
Power-Q High Voltage RF MLCCs
Overview & PDF
Capacitance / Voltage Selection
Electrical Characteristics
Lead Style Selection
Part Number Breakdown
Save to Cart (for Requests/Orders)
Porcelain Substitute NPO Ceramic Caps
Overview & PDF
Available Capacitance Selection
Dielectric Characteristics
Mechanical & Environmental Characteristics
RF Characteristics
Part Number Breakdown
Save to Cart (for Requests/Orders)
Technical Notes
Overview
RoHS Compliance
Tape & Reel Packaging
Chip Capacitor Tape & Reel Packaging
RF Antenna Tape & Reel Packaging
RF Component Tape & Reel Packaging
Inductor Tape & Reel Packaging
RF Capacitors & Inductors
Storage and Solderability Checklist
Q & ESR Explained
SRF & PRF for RF Capacitors
Measuring S-Parameters of High-Q Caps
S-Parameter Accuracy
Capacitor Mounting & S-Parameters
Capacitor RF Current & Power
Trimming Characteristics of LASERtrim® Chip Caps
Dishal Bandpass Filter Tuning Using LASERtrim® Chip Caps
Reference Oscillator Tuning Using LASERtrim® Chip Caps
High Frequency Inductor Modeling Utilizing MLISoft®
Soldering Requirements for MLCC
Integrated Passives (RF Comp)
Chip Balun: Definitions & Measurement Methodology
Chip Antenna Layout Considerations for 802.11
Prototyping Kits
Overview & PDF
Capacitor and Inductor Designer Kits
(Individual) Capacitor and Inductor Designer Kits
Tuning Capacitor Kits
Single Layer Capacitor Kits
WireWound Inductor Kits
2.45 Ghz Designer Kit for WLAN, Bluetooth, ISM and 802.11
5.5 Ghz Designer Kit for WLAN, Bluetooth, ISM and 802.11
Cross Reference Charts
Capacitor Cross Reference
Monolithic Inductor Cross Reference
Wirewound Inductor Cross Reference
C-Series to S-Series Cross Reference
Modeling Software
JTIsoft® Overview
Detailed Information
Screenshots
Download
Designer Libraries
Overview
Agilent ADS Libraries
AWR MWO Libraries
Eagleware Genesys Libraries
Modelithics Global Models
Part Number Search
Search for Multiple
Parameter Search
Volt
6.3
10
16
25
50
100
200
250
300
500
1000
1250
1500
1600
2500
3600
7200
Size
01005
0201
0402
0508
0603
0805
1111
1206
1210
1812
2225
2520
3838
4035
Value
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2
2.1
2.2
2.3
2.4
2.7
3
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7
8.2
8.7
9
9.1
10
11
12
13
15
16
18
19
20
22
23
24
27
30
33
36
39
40
43
47
56
68
75
82
100
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150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6300
6800
7500
8200
10000
pF/nH
RF Components
Select a Component Type
Antennas
Balun-Filters
Baluns
Baluns, Dual Band
Baluns, Matching
Band Pass Filters, 2.45 GHz
Band Pass Filters, 5.5 GHz
Band Pass Filters, Other
Couplers
Couplers w/ LP Filters
Couplers (2xBand, 1xPath)
Couplers (2xBand, 2xPath)
Couplers (Splitter)
Diplexers (LPF/HPF type)
Diplexers (LPF/BPF type)
Diplexers (Harmonic Rej.)
EMI Filter Arrays
High Pass Filters
Low Pass Filters
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Technical Notes
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Inductor Packaging
This technical note is also available in
PDF Format
:
Inductor Packaging PDF (161k)
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