<!DOCTYPE Substrate>
<SubstrateModel>
    <stack BAL_TYPE="SPECIFIED" BAL_NUM="4" PURPOSE_TREATMENT="USE_ALL_EXCEPT_SPECIFIED" SPECIFIED_PURPOSES="">
        <material BAL_TYPE="INHERIT" BAL_NUM="0" materialname="AIR"/>
        <interface BAL_TYPE="INHERIT" BAL_NUM="0" materialname="" thick="" thickunit="micron"/>
        <material BAL_TYPE="INHERIT" BAL_NUM="0" materialname="FR_4" thick="0.8" thickunit="millimeter"/>
        <interface BAL_TYPE="INHERIT" BAL_NUM="0" materialname="" thick="" thickunit="micron"/>
        <material BAL_TYPE="INHERIT" BAL_NUM="0" materialname="AIR"/>
    </stack>
    <layers>
        <layer toprough="" subtype="0" sheet="0" materialname="Copper" expand="0" processRole="1" index="0" precedence="0" layer="0" negative="0" thick="-1.4" pinsOnly="0" bottomrough="" thickunit="mil" angle="90.0"/>
        <layer toprough="" subtype="0" sheet="0" materialname="Copper" expand="0" processRole="1" index="1" precedence="1" layer="1" negative="0" thick="1.4" pinsOnly="0" bottomrough="" thickunit="mil" angle="90"/>
    </layers>
    <vias>
        <via platingdielectricmaterial="AIR" index2="1" subtype="0" platingthickness="" materialname="Copper" rough="" processRole="4" precedence="0" layer="2" index1="0" platingenabled="0" platingthicknessunit="micron"/>
        <via platingdielectricmaterial="AIR" index2="1" subtype="0" platingthickness="" materialname="Copper" rough="" processRole="4" precedence="0" layer="3" index1="0" platingenabled="0" platingthicknessunit="micron"/>
    </vias>
    <substrates/>
</SubstrateModel>
