LTCC Foundry Service
Johanson Technology offers a foundry service that enables the design of custom LTCC-based products using our established design rules. This service allows our customers to retain full control of the electrical design while we provide precision manufacturing capabilities.
An internally developed LTCC tape system delivers exceptional material stability and design flexibility.
Contact our Applications Engineering team for more information.
| Design Rules | Standard (mm) | Advanced (mm) |
|---|---|---|
| (A) Via Hole Dia | 0.125, 0.18 | 0.06 (min) |
| (B) Via Cover Dot Dia | >= Via + 0.03 | Via + 0.02 |
| (C) Via Center Spacing | >= 0.20 (for 0.07 via) | 0.18 (for 0.05 via) |
| (D) Via Cover Dot Edge to Line Edge | > 0.10 | > 0.08 |
| (E) Line Width | >= 0.10 | >= 0.05 |
| (F) Line to Line Spacing | >= 0.10 | >= 0.08 |
| (G) Line Center Spacing | >= 0.18 | >= 0.13 |
| (H) Outside Edge to Via Center | >= 0.15 | >= 0.135 |
| (I) Line Over Outside Edge for Cutting | >= 0.05 | >= 0.05 |
| (J) Outside Edge to Line Clearance | >= 0.10 | >= 0.10 |
| (M) Buried Ground Plane Spacing | 0.10 | >= 0.10 |
| (N) Feed thru Spacing | 0.15 | >= 0.10 |
| Substrate thickness | 0.5 to 1.6 | 0.3 to 2.4 |
| Number of Layers | Up to 20 | Up to 30 |
| LTCC Tape Characteristics | JTI |
|---|---|
| Dielectric Constant (@ 3GHz) | 7.5 |
| Dielectric Loss (@ 3GHz) | 0.33% |
| TCE (25-300°C) (ppm/°C) | 4.7 |