Inductors

List of technical and application notes relevant to Johanson Technology's RF Inductors (Wirewound & Ceramic):

Title	Purpose / Key Insight
High Frequency Inductor Modeling utilizing MLISoft®	Explains how Johanson’s MLISoft® simulation tool models high-frequency inductor performance. Assists engineers predict impedance, Q factor, and SRF to optimize RF designs before prototyping.
Inductor Marking and Orientation RF Study	Presents findings on how marking orientation affects inductor RF performance on PCBs. Provides guidance to ensure consistent results in assembly and test setups.
Wirewound Inductors PCB Pad Layout Recommendations	Outlines pad design and spacing guidelines for reliable solder joints and minimized parasitics. Improves RF performance and reduces risk of assembly-induced failures.
MSL Rating (Moisture Level Sensitivity)	Defines the Moisture Sensitivity Levels (MSL) for Johanson inductors. Guides proper handling and reflow practices to prevent moisture-related damage such as delamination or popcorning.
Recommended Storage Conditions	Lists proper environmental and handling conditions (humidity, temperature, packaging) for inductors. Ensures long-term solderability and reliability before assembly.
Tin Whiskers Family Qualifications - Class 2	Summarizes Johanson’s tin whisker qualification testing for inductors under Class 2 standards. Confirms plating finish reliability for automotive and high-reliability markets.