Integrated Passive Components

Below is a list of technical and application notes relevant to Johanson Technology's Integrated Passive Components (Baluns, Balun-Filter Combinations, Band Pass Filters, Couplers, Diplexers & Triplexers, High Pass Filters, Low Pass Filters, Power Dividers.

Title	Purpose / Key Insight
1.9 GHz DECT NR+ Antenna & Band Pass Filter	Integrated antenna + filter solution tailored for DECT NR+ wireless standard at 1.9 GHz. Provides compact size, optimized performance, and reduced external component count.
2450BM14A0002 Matched Balun for TI 253X Family Chipsets	Johanson matched balun designed for TI CC253X chipsets. Simplifies RF design with proper impedance transformation.
2450BM15A0015 125° Temperature Test	High-temperature reliability testing up to 125 °C. Ensures stability for automotive, industrial, and rugged IoT use.
Chip Balun: Definitions & Measurements	Explains balun function, terminology, and test methodology. Guides accurate evaluation of insertion/return loss and phase balance.
IPDs to Enhance TI Chipsets RF Front-End	Introduces Johanson IPDs optimized for TI wireless chipsets. Improves efficiency while reducing PCB size and components.
TI CC1352 x Johanson Technology 0900PC15A0036	Antenna solution tuned for TI CC1352 chipset. Enables long-range sub-GHz IoT applications in compact form.
IPD for Semtech SX1261 / SX1262 / LLCC68	Custom IPD solution for Semtech LoRa chipsets. Enhances sensitivity, reduces parts, and speeds IoT development.
High Power Coupler	Supports signal monitoring and feedback in high-power RF systems. Ideal for wireless infrastructure and test equipment.
Part Number Explanation - Integrated Passives	Breaks down Johanson’s IPD part number structure. Clarifies function, frequency, tolerance, and package size codes.
MSL Rating (Moisture Level Sensitivity)	Defines safe exposure time before soldering. Prevents moisture-related damage during assembly.
Recommended Storage Conditions	Guidelines to maintain component integrity (humidity, temp, packaging). Ensures solderability and reliability over time.
Silver Leaded Components & Soldering Profile	Storage: Must be vacuum-sealed and protected from moisture/sulfur/chlorine. Soldering: Follow controlled reflow profile for reliable joints.