LEO (Low Earth Orbit) Satellites
North American Manufacturing and High Reliability Passive Components with Custom Solutions
Overview
As demand rapidly grows for compact, high-performance RF, microwave,and power electronics components in LEO (Low Earth Orbit) satellite applications, Johanson is strategically positioned to support your mission-critical designs.
With U.S.-based design and manufacturing and in-house MIL-STD testing at our California facility, we provide high-reliability passive components engineered to meet the rigorous requirements of LEO, aerospace, and space-grade systems.
Applications-to-Products Chart
| TYPICAL APPLICATIONS | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Solar Arrays | ● | ● | ● | ● | ● | ● | ||||||||
| Battery Packs | ● | ● | ● | ● | ● | ● | ● | |||||||
| Power Control Unit | ● | ● | ● | ● | ● | ● | ● | |||||||
| Transponders | ● | ● | ● | ● | ● | ● | ● | |||||||
| RF Front-End Modules | ● | ● | ● | ● | ● | ● | ● | ● | ||||||
| Antennas | ● | ● | ● | ● | ● | ● | ||||||||
| Software-Defined Radios (SDRs) | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ||||
| Sun Sensors | ● | ● | ● | ● | ● | |||||||||
| Earth Horizon Sensors | ||||||||||||||
| Star Trackers | ● | ● | ● | ● | ||||||||||
| Magnetometers | ● | ● | ● | ● | ● | |||||||||
| Gyroscopes | ● | ● | ● | |||||||||||
| Reaction Wheels | ● | ● | ● | ● | ● | ● | ||||||||
| Magnetorquers | ● | ● | ● | ● | ● | ● | ● | |||||||
| Control Moment Gyros (for larger satellites) | ● | ● | ● | ● | ● | ● | ||||||||
| Thrusters (used for both orientation and propulsion) | ● | ● | ● | ● | ● | ● | ● | |||||||
| Flight Computers / Microcontrollers | ● | ● | ● | ● | ● | ● | ● | |||||||
| Storage Modules: Solid-state drives (SSDs) or NOR flash | ● | ● | ● | ● | ● | |||||||||
| Heaters (resistive) | ● | ● | ● | |||||||||||
| Louvers or Heat Switches | ● | ● | ● | ● | ||||||||||
| Radar Systems (e.g. Synthetic Aperture Radar) | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | |||
| Scientific Instruments (e.g. particle detectors, spectrometers) | ● | ● | ● | ● | ● | |||||||||
| IoT Sensors (for smallest constellations) | ● | ● | ● | |||||||||||
| Data Buses: CAN, RS-422, I2C, or SpaceWire | ● | ● | ● | ● | ● | |||||||||
| GPS Receivers | ● | ● | ● | ● | ● | ● | ● | ● | ||||||
| Control Electronics for Miniature Propulsion Units | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | |
| Watchdog Timers & Reset Circuits | ● | ● |
Don't see your application? Contact our Applications Engineers to customize a solution for your unique design requirements.
Comprehensive Mil-Standard
Testing Groups A, B & C
- Available as necessary
Electrical & Mechanical Inspections
- 100% Electrical Testing
- Cap, DF, IR, DWV, Voltage Breakdown
- 100% Visual Inspection (Mil 883 Class K or S Options)
- Full Data on Serialized Units
- Hot IR Testing
- Temperature Capacitance Coefficient (TCC)
- Temperature Voltage Coefficient (TVC)
Analytical Testing
- Destructive Physical Analysis (DPA)
- Radiographic Inspection
- SEM Inspection
- Solderability Testing
- Acoustic Microscopy (Sonoscan) Inspection
- XRF Analysis
RF & Microwave Testing Expertise
- Vector Network Analyzer Measurements
- Resonant Line Measurements for ESR at Frequency
Environmental Testing
- Burn In / Voltage Conditioning
- Life Testing
- Class H, K or S Element Evaluation
- HALT / HASS Testing
- Humidity Testing
- Moisture Resistance
- Resistance to Solder Heat
- Shear Test / Bond Pull Test
- Bend Testing
- Steam Age
- Temperature Cycling
- Thermal Shock Testing
- Shock / Vibration Testing
- Wire Bond Testing
RESOURCE: Simulation Software and Designer Libraries
| Termination Type | Barrier to Prevent Solder Leaching | RoHS | Primary Applications |
|---|---|---|---|
| Ni/Sn | Ni | Yes | All solder applications where RoHS is required. This is Johanson’s standard termination used by the largest number of customers. Most likely to be in stock at Johanson or at Johanson authorized distributors. |
| Ni/SnPb | Ni | No | Military applications where the lead (Pb) mitigates Tin whisker growth. |
| Flexterm Ni/Sn | Ni | Yes | Flexible terminations for high physical stress applications. |
| Flexterm Ni/SnPb | Ni | No | Flexible terminations for high physical stress applications. |
| Ni/Au Gold Termination | Ni | Yes | Parts are epoxied in place or a mix of solder and epoxy attachment is used. Controlled Au thickness to avoid Gold embrittlement issues when soldering. Premium price. |
| Cu/Sn (Copper barrier) | Cu | Yes | This non-magnetic termination is best suited for application where very high inductance / magnetic fields are present. Use where RoHS is required. Most common non-magnetic termination. |
| Cu/SnPb (Copper barrier) | Cu | No | This non-magnetic termination is best suited for application where very high inductance / magnetic fields are present. |
| PdAg | None | No | No plating - solderable thick film PdAg alloy termination. |
| PtAg | None | Yes | No plating - solderable thick film PtAg alloy termination. Premium price. |
| Termination | Barrier | RoHS | Notes |
|---|---|---|---|
| TiW/Ni/Au | Ni | Yes | Chip & Au wire where capacitor is soldered in place or a mix of solder and epoxy attachment is used. |
| TiW/Au | None | Yes | Chip & Au wire where capacitor is epoxy attached. Optimum termination for wirebonding. Cannot solder this chip as substantial leaching will occur. |
| Material | Nickel Underplate | Solderable | Notes |
|---|---|---|---|
| Ni | None | Yes | Used in very high-temp applications |
| Cu/Ni/SnPb | Ni | No | Typically used in military applications |
| CuSn6 Phosphor Bronze | Ni | No | SnPb plate |
| Iron-Nickel Alloy | Ni | Yes | Sn plate |
| Pure Silver Leads | None | Yes | Used in very high power RF. Premium price. |
What passive components are used in Low Earth Orbit (LEO) satellites?
LEO satellites commonly use high-Q RF capacitors, RF inductors, integrated passive devices, antennas, EMI filters, and thin-film components to support satellite communications, phased arrays, power systems, navigation, and RF front-end circuitry.
Why is component size important in LEO satellite design?
Every gram and cubic centimeter impacts launch costs. Engineers seek compact, lightweight passive components that maintain electrical performance while supporting SWaP-C (Size, Weight, Power, and Cost) objectives.
Why are high-Q capacitors important for LEO satellite communications?
High-Q capacitors minimize insertion loss, improve signal integrity, and support efficient RF performance in satellite payloads, phased-array antennas, beamforming networks, and high-frequency communication systems.
What are the reliability requirements for passive components in LEO satellites?
Passive components used in LEO satellites must withstand vibration, shock, thermal cycling, vacuum conditions, and long mission lifetimes while maintaining stable electrical performance.
What frequencies are commonly used in LEO satellite communications?
LEO satellite systems typically operate in L-band, S-band, X-band, Ku-band, Ka-band, and emerging V-band frequencies depending on the mission, payload, and communication requirements.
How do high-Q capacitors improve satellite RF front-end performance?
High-Q capacitors reduce RF losses, improve efficiency, enhance filter performance, and support stable operation in low-noise amplifiers (LNAs), power amplifiers, transceivers, and beamforming circuits.
What passive components help reduce interference in satellite communications?
EMI filters, RF filters, high-Q capacitors, and inductors help suppress unwanted signals, improve electromagnetic compatibility (EMC), and maintain signal integrity in crowded RF environments
What should engineers consider when selecting passive components for LEO satellites?
Engineers should evaluate frequency performance, insertion loss, reliability, temperature stability, radiation tolerance requirements, package size, and long-term supply chain availability.
If you have unique requirements or require additional technical information, submit a technical request on our website at: Ask a Question.