Drones / UAV
SWaP-Optimized Passive Components for Drones & UAVs
High Reliability | SWaP-Optimized RF & Power Solutions | US Owned Company | North American Manufacturing
Modern UAV and drone platforms require Size, Weight, and Power (SWaP) optimization without compromising RF performance, signal integrity, or power efficiency. Johanson designs and manufactures high-reliability passive components engineered for compact drone electronics, secure RF communications, GNSS navigation, EMI control, and efficient power regulation in mission-critical environments.
Backed by over 60 years of U.S.-based engineering and North American manufacturing, Johanson delivers SWaP-optimized passive solutions for UAV, mil/aero, and defense platforms, including:
- RF and power components engineered for SWaP-constrained designs
- Custom and footprint-compatible second-source alternatives
- Stable electrical performance under vibration, shock, and temperature extremes
- Domestic manufacturing aligned with aerospace and defense requirements
Built for mission-critical UAV applications. Designed for performance.
Contact our Applications Engineers today for support or to request samples.
Application-to-Products Chart
| All drones | X |
| Large-Predator Type Drones | X |
EMI Filters |
High-Q MLCC |
Hi-Rel Low Voltage NPO/X7R MLCCs |
High Cap X7R/HiQ MLCC (1–1000µF) |
Antennas |
Integrated Passive Components |
RF Inductors |
High Voltage MLCC (500V–6kV) |
SMPS Stacked MLCCs |
High Voltage Radial |
Single Layer Capacitors |
Thin Film |
Planars & Discoidal |
|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TYPICAL APPLICATIONS | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 |
| Autonomous Navigation & AI Modules | • | • | • | • | • | • | |||||||
| Avionics Power Regulation | • | • | • | ||||||||||
| EMI & RFI Mitigation | • | • | • | ||||||||||
| Electronic Motor Noise Mitigation | • | • | • | ||||||||||
| Electronic Countermeasures (ECM) | • | • | • | ||||||||||
| Encrypted Communications | • | • | • | • | |||||||||
| Filtered Bulkhead Connectors | • | ||||||||||||
| First-Person View (FPV) / Immersive Goggles | • | • | • | • | |||||||||
| Flight Control Systems (FCs) | • | • | • | • | • | • | |||||||
| GNSS Navigation Modules | • | • | • | • | • | ||||||||
| Ignition & Detonator Control Modules | • | • | • | • | • | • | |||||||
| Long-Endurance Battery Packs | • | • | • | ||||||||||
| Microwave Systems & Phased Arrays | • | • | • | • | |||||||||
| Miniaturized Synthesizers & Oscillators | • | • | • | • | • | • | • | ||||||
| Payload Release Systems | • | • | |||||||||||
| Portable Power Units (PPUs) | • | ||||||||||||
| Power Distribution Units (PDUs) | • | • | • | • | • | ||||||||
| Radar Altimeters & Proximity Sensors | • | • | • | ||||||||||
| SWaP-Optimized Avionics | • | • | • | ||||||||||
| Thermal Imaging & Targeting Systems | • | • | • |
Drones (UAVs) demand precise navigation, reliable communication, and efficient power regulation within compact platforms. To meet these needs, JOHANSON provides passive components that support both RF and power applications. Backed by 60+ years of design and manufacturing, our engineers collaborate on custom solutions. As a North American owned and manufactured company, JOHANSON is uniquely positioned to deliver high-reliability components.
In-House Testing Capabilities
In addition to manufacturing, the Camarillo, CA facility has a complete High Reliability department with in-house testing capabilities.
Comprehensive Mil-Standard Testing Groups A, B & C
• Available as necessary
Electrical & Mechanical Inspections
- Hot IR Testing
- 100% Electrical Testing
- Full Data on Serialized Units
- 100% Visual Inspection (Mil 883 Class K or S Options)
- Cap, DF, IR, DWV, Voltage Breakdown
- Temperature Voltage Coefficient (TVC)
- Temperature Capacitance Coefficient (TCC)
Analytical Testing
- XRF Analysis
- SEM Inspection
- Solderability Testing
- Radiographic Inspection
- Destructive Physical Analysis (DPA)
- Acoustic Microscopy (Sonoscan) Inspection
RF & Microwave Testing Expertise
- Vector Network Analyzer Measurements
- Resonant Line Measurements for ESR at Frequency
Environmental Testing
- Life Testing
- Steam Age
- Bend Testing
- Humidity Testing
- Wire Bond Testing
- Moisture Resistance
- Temperature Cycling
- HALT / HASS Testing
- Thermal Shock Testing
- Shock / Vibration Testing
- Resistance to Solder Heat
- Shear Test / Bond Pull Test
- Burn In / Voltage Conditioning
- Class H, K or S Element Evaluation
RESOURCE: Simulation Software & Designer Libraries:
| Termination Type | Solder Barrier Prevent Leaching | RoHS | Primary Applications |
|---|---|---|---|
| Ni/Sn | Ni | Yes | All solder applications where RoHS is required. Johanson’s standard termination used by largest number of customers. Most likely to be in stock at Johanson or authorized distributors. |
| Ni/SnPb | Ni | No | Military applications where lead (Pb) mitigates Tin whisker growth. |
| Flexterm Ni/Sn | Ni | Yes | Flexible terminations for high physical stress applications |
| Flexterm Ni/SnPb | Ni | No | Flexible terminations for high physical stress applications |
| Ni/Au Gold Termination | Ni | Yes | Parts are epoxied in place or a mix of solder and epoxy attachment is used. Controlled Au thickness to avoid Gold embrittlement issues when soldering. Premium price. |
| Cu/Sn (Copper barrier) | Cu | Yes | This non-magnetic termination is best suited for application where very high inductance / magnetic fields are present. Use where RoHS is required. Most common non-magnetic termination. |
| Cu/SnPb (Copper barrier) | Cu | No | This non-magnetic termination is best suited for application where very high inductance / magnetic fields are present. |
| PdAg | None | Yes | No plating - solderable thick film PdAg alloy termination. Premium price. |
| PtAg | None | Yes | No plating - solderable thick film PtAg alloy termination. Premium price. |
| Termination Type | Solder Barrier Prevent Leaching | RoHS | Primary Applications |
|---|---|---|---|
| TiW/Ni/Au | Ni | Yes | Chip & Au wire where capacitor is soldered in place or mix of solder and epoxy attachment is used. |
| TiW/Au | None | Yes | Chip & Au wire where capacitor is epoxy attached. Optimum termination for wirebonding. Cannot solder this chip as substantial leaching will occur. |
| Termination Type | Solder Barrier Prevent Leaching | RoHS | Primary Applications |
|---|---|---|---|
| Ni | None | Yes | Used in very high-temp applications |
| Cu/Ni/SnPb | Ni | No | Typically used in military applications |
| CuSn6 Phosphor Bronze | Ni | No | SnPb plate |
| Iron-Nickel Alloy | Ni | Yes | Sn plate |
| Pure Silver Leads | None | Yes | Used in very high power RF. Premium price. |