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Integrated Passive Components ( RoHS Compliant)

Johanson Technology designes and manufactures a line of small, highly stable and integrated RF ceramic components manufactured with a proprietary LTCC (low temperature co-fired ceramic) process and materials. These components operate and thrive over several RF bands from 300MHz to 14GHz covering Cellular, DECT, WLAN, WiMax, all ISM, Bluetooth, 802.11 (a,b and g) and GPS applications.

Key Features:

  • Custom Solutions
  • LTCC (Low Temp Co-Fired Ceramics) Based Designs
  • Low Insertion Loss
  • Miniature Size / Ultra-Low Profiles
  • Extreamly Temperature Stable
  • Surface Mount
  • RoHS/REACH Compliant Standard, Use no Suffix

Johanson USB Dongle Device

Supported Application Bands:

  • All ISM bands (Industrial Scientific, and Medical)
    • 315/433/783/868/915/950/2400 MHz
  • GSM/EDGE/GPRS/DCS/PCS/WCDMA
  • All ISM bands (Industrial Scientific, and Medical)
    • 315/433/783/868/915/950/2400 MHz
  • GSM/EDGE/GPRS/DCS/PCS/WCDMA
  • Wireless LAN
  • Bluetooth
  • HomeRF
  • Zigbee operational bands
  • GPS
  • WiFi
  • Zigbee
  • UNII
  • WiMAX 802.16
  • MiMo
  • UWB
RFCC Group Capacitors image

Ceramic Chip Antennas ( RoHS Compliant)

Applications:

  • 88MHz-108MHz
  • 400-500MHz
  • 780MHz - 960MHz (ISM)
  • 1.5 - 1.6 GHz (GPS)
  • 1.9GHZ (DECT)
  • 2.45 GHz (Bluetooth™, 802.11 b+g)
  • 2.5 - 2.9 GHz
  • 3.1 - 10.3 GHz (UWB)
  • 5.4GHz WiFi
  • 5.25 - 5.75 GHz (UNII, 802.11a)
Johanson Technology is proud to offer the latest in Chip Antenna technology. These LTCC based Chip Antennas are leading the industry based on gain and size (footprint) performance in the portable wireless arena. Currently, we offer solutions in the following frequency bands:

In addition to the array of listed components we can support custom solutions for high volume applications with design flexibility and short development times.
Contact us today with your specific technical requirements.

Case Size Summary

case 07-1 Johanson Technology
case 14-1 Johanson Technology
case 14-2 Johanson Technology
case 15-1 Johanson Technology
case 15-2 Johanson Technology
case 15-3 Johanson Technology
case 15-4 Johanson Technology
case 18-1 Johanson Technology
case 18-2 Johanson Technology
case 18-3 Johanson Technology
case 18-4 Johanson Technology
case 39-1 Johanson Technology
case 39-2 Johanson Technology
case 39-3 Johanson Technology
case 41-1 Johanson Technology
case 41-2 Johanson Technology

Soldering Profiles and Guidelines for SMT Ceramic Components

Typical Soldering Profile for Lead-free Process: RFCCs

Typical Soldering Profile for Lead-free Process: RFCCs
Typical Soldering Profile for Solderable Silver (Ag) Terminated Components:**
Typical Soldering Profile for Solderable Silver (Ag) Terminated Components:**
Lead Free Solder, i.e. SAC 305, is recommended
**Johanson Technology′s P/N's with Solderable Silver (Ag/Pt) Terminations requiring Vacuum Packaging
0200FA18A02000300LA15A03000400FA15A04000400FA18A0400
0400LP15A01000433BM15A00010866BL15C2000868BM15C0001
0869LD14A18100892DP15A19400892DP15B18500892FB15A0100
0892LP07A01360896BL14B0500896BM15A00010896BM15A0025
0896BM15B00160900BL15A1000900BL15C0500915BM15A0001
1000ED18A00011200BP44A5751200LP41B05001200LP41C0500
1400BP41A05501810BP07B2001900HP41B05001900HP41C0500
2025LP15A12251905BP18A00501906BP18C0271906BP39B027
2450BM07A00042345FB39A00502350FB39A00502450BL07A0100
2450BM15A00152450BM14_00072450BM14A00042450BM15B0009
2450BP07A01002450BP08A01002450BP15D01002450BP14D0100
2450BP14E01002450BP14F01002450BP15J01002450BP15E0100
2450BP15F01002450BP15G01002450BP15U01002450BP15K0100
2450BP15Q01002450BP39D100E2450BP15V01002450BP39D100B
2450BP39D100C2450FB15A01002450BP39F1002450DP15R5400
2450DP15S54002500BP15M4002500FB16A04003350BP39A0500
2595FB16A01002595FB39A00502600BP14M02003550FB39B0050
3500FB16A01003500FB39A00503550BP14A05005375BP15A0950
3600BP14M06003600BP14N06003600BP15M6000896FB15A0100
5400BP14A09505425BP15A10505525BP15B07502450BM08B0003
2450DP39K54002450DP39L5400
www.johansontechnology.com/silverleads

Typical Soldering Profile for Tin / Lead Terminated Components:
Tin flow Soldering GraphTin Reflow Soldering Graph

Hand Soldering
The recommended temperature for hand soldering our integrated passives is 350C for 3-5sec max
Note:
The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order.
Lead Free Solder (SAC 305) is recommended

Example Circuit Diagram

IPC example diagram

Example Circuit Diagram Integrated Passives Part number Explanation PDF (49kb)

General format is: FFFFPPCCVBBBBT where:
FFFF is the 4 digit Frequency in Megahertz (unless otherwise specified)
PP is the 2 character Product code
AT = Antenna CP = Coupler
AM = Antenna Module Assembly CF = Coupler Filter
AS = Antenna Switch Module CH = Coupler Hybrid
AD = Dual-Band Antenna DP = Diplexer
BL = Balun FA = Filter Array
BD = Balun, Dual-Band FB = Filter-Balun
M = Chipset Specific Impedance-Matched Balun or Balun-Filter HP = High Pass Filter
BP = Band Pass Filter LD = Low Pass Filter, Dual-Band
CD = Coupler, Dual Band LP = Low Pass Filter
  NF = Notch Filter (Band-Stop Filter)
CC is the 2-digit Case Size Code (e.g. 07 is EIA 0402, 14 is EIA 0603, 15 is EIA 0805, 18 is EIA 1206)
V is a 1 character Version/Revision code
BBBB is 3 or 4 digit Bandwidth, differential impedance (baluns only), or specific chipset denomination
T is the character tape code:
Tape material Code
Paper Tape standard (EIA 0603 and smaller) T
Embossed Tape standard (EIA 0805 and smaller) E
Paper Tape rotated (non-std, EIA 0603 and smaller)* A
Embossed Tape rotated (non-std, EIA 0805 and smaller)* R
*Only available for selected components, please consult the factor for availability and MOQs that apply

Examples:
  • 0868AT43A0020E is an 868MHz antenna, case size 43, revision “A” with 20MHz of Bandwidth, embossed tape & reel
  • 2450BM15A0002S is 2450MHz Impedance-matched Balun-BPF, case size 15 (EIA 0805), 100MHz BW, designed for to T.I. CC2530 chipset, bulk (loose) packaging