Modules and Substrates
Johanson Technology has the capability to produce a wide range of application specific components for wireless communication such as Diplexer Switch, VCO, PA and highly integrated RF modules using LTCC (Low Temperature Co-fired Ceramic) technology. We offer extensive expertise using DuPont, Ferro and internally developed LTCC tape systems.
Johanson Technology offers a wide range of dielectrics for use in application specific environments. These materials are available in both lapped and "as fired" conditions as well as Metallized and non-metailzed substrates. Substrate sizes range from 0.50" X 0.50" to 2" X 2" depending on thickness.