Integrated Passive Components ( RoHS Compliant)

Johanson Technology designs and manufactures a line of small, highly stable and integrated RF ceramic components manufactured with a proprietary LTCC (low temperature co-fired ceramic) process and materials. These components operate and thrive over several RF bands from 400MHz to 30GHz covering Cellular, DECT, WLAN, WiMax, all ISM, Bluetooth, 802.11 (a,b and g) and GPS applications.

RFCC Group Capacitors image
Key Features:

  • Custom Solutions
  • LTCC (Low Temp Co-Fired Ceramics) Based Designs
  • Low Insertion Loss
  • Miniature Size / Ultra-Low Profiles
  • Extremely Temperature Stable
  • Surface Mount
  • RoHS/REACH Compliant Standard, Use no Suffix
  • AEC-Q200 Automotive Qualification (as required)
Supported Application Bands:

  • All ISM bands (Industrial Scientific, and Medical)
    • 315/433/783/868
    • 915/950/2400MHz
  • Wireless LAN
  • Bluetooth
  • HomeRF
  • Zigbee operational bands
  • GPS
  • WiFi
  • Zigbee
  • UNII
  • WiMAX 802.16
  • MiMo
  • UWB
Ceramic Chip Antennas ( RoHS Compliant)


  • 88MHz-108MHz
  • 400-500MHz
  • 780MHz - 960MHz (ISM)
  • 1.5 - 1.6 GHz (GPS)
  • 1.9GHZ (DECT)
  • 2.45 GHz (Bluetooth™, 802.11 b+g)
  • 2.5 - 2.9 GHz
  • 3.1 - 10.3 GHz (UWB)
  • 5.4GHz WiFi
  • 5.25 - 5.75 GHz (UNII, 802.11a)
Johanson Technology is proud to offer the latest in Chip Antenna technology. These LTCC based Chip Antennas are leading the industry based on gain and size (footprint) performance in the portable wireless arena. Currently, we offer solutions in the following frequency bands:
RF Chip Antenna Training Module by Digi-Key
Download the PowerPoint Presentation:
LTCC Chip Antennas - How to Maximize Performance
Johanson RF Antenna

Integrated Passive Components Information

Case Size Summary
case 07-1 Johanson Technology
case 14-1 Johanson Technology
case 14-2 Johanson Technology
case 15-1 Johanson Technology
case 15-2 Johanson Technology
case 15-3 Johanson Technology
case 15-4 Johanson Technology
case 18-1 Johanson Technology
case 18-2 Johanson Technology
case 18-3 Johanson Technology
case 18-4 Johanson Technology
case 39-1 Johanson Technology
case 39-2 Johanson Technology
case 39-3 Johanson Technology
case 41-1 Johanson Technology
case 41-2 Johanson Technology
Example Circuit Diagram
IPC example diagram

General format is: FFFFPPCCVBBBBT where:
FFFF is the 4 digit Frequency in Megahertz (unless otherwise specified)
PP is the 2 character Product code

AT = AntennaCP = Coupler
AM = Antenna Module AssemblyCF = Coupler Filter
AS = Antenna Switch ModuleCH = Coupler Hybrid
AD = Dual-Band AntennaDP = Diplexer
BL = BalunFA = Filter Array
BD = Balun, Dual-BandFB = Filter-Balun
M = Chipset Specific Impedance-Matched Balun or Balun-FilterHP = High Pass Filter
BP = Band Pass FilterLD = Low Pass Filter, Dual-Band
CD = Coupler, Dual BandLP = Low Pass Filter
 NF = Notch Filter (Band-Stop Filter)
CC is the 2-digit Case Size Code (e.g. 07 is EIA 0402, 14 is EIA 0603, 15 is EIA 0805, 18 is EIA 1206)
V is a 1 character Version/Revision code
BBBB is 3 or 4 digit Bandwidth, differential impedance (baluns only), or specific chipset denomination
T is the character tape code:
Tape materialCode
Paper Tape standard (EIA 0603 and smaller)T
Embossed Tape standard (EIA 0805 and larger)E
Paper Tape rotated (non-std, EIA 0603 and smaller)*A
Embossed Tape rotated (non-std, EIA 0805 and larger)*R
*Only available for selected components, please consult the factor for availability and MOQs that apply

  • 0868AT43A0020E is an 868MHz antenna, case size 43, revision “A” with 20MHz of Bandwidth, embossed tape & reel
  • 2450BM15A0002S is 2450MHz Impedance-matched Balun-BPF, case size 15 (EIA 0805), 100MHz BW, designed for to T.I. CC2530 chipset, bulk (loose) packaging
Soldering Profiles and Guidelines for SMT Ceramic Components

Typical Soldering Profile for Lead-free Process: RFCCs

Typical Soldering Profile for Lead-free Process: RFCCs
Typical Soldering Profile for Lead-free Process: RFCCs
Typical Soldering Profile for Solderable Silver (Ag) Terminated Components:**
Typical Soldering Profile for Solderable Silver (Ag) Terminated Components:**

Lead Free Solder, i.e. SAC 305, is recommended

**Johanson Technology′s P/N's with Solderable Silver (Ag/Pt) Terminations requiring Vacuum Packaging
Silverleads profile

Typical Soldering Profile for Tin / Lead Terminated Components:

Tin flow Soldering Graph Tin Reflow Soldering Graph

Hand Soldering
The recommended temperature for hand soldering our integrated passives is 350C for 3-5sec max
The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order.
Lead Free Solder (SAC 305) is recommended