Integrated Passive Components ( RoHS Compliant)

Johanson Technology designs and manufactures a line of small, highly stable and integrated RF ceramic components manufactured with a proprietary LTCC (low temperature co-fired ceramic) process and materials. These components operate and thrive over several RF bands from 300MHz to 14GHz covering Cellular, DECT, WLAN, WiMax, all ISM, Bluetooth, 802.11 (a,b and g) and GPS applications.

Key Features:

  • Custom Solutions
  • LTCC (Low Temp Co-Fired Ceramics) Based Designs
  • Low Insertion Loss
  • Miniature Size / Ultra-Low Profiles
  • Extreamly Temperature Stable
  • Surface Mount
  • RoHS/REACH Compliant Standard, Use no Suffix

Johanson USB Dongle Device

Supported Application Bands:

  • All ISM bands (Industrial Scientific, and Medical)
    • 315/433/783/868/915/950/2400 MHz
  • All ISM bands (Industrial Scientific, and Medical)
    • 315/433/783/868/915/950/2400 MHz
  • Wireless LAN
  • Bluetooth
  • HomeRF
  • Zigbee operational bands
  • GPS
  • WiFi
  • Zigbee
  • UNII
  • WiMAX 802.16
  • MiMo
  • UWB
RFCC Group Capacitors image

Ceramic Chip Antennas ( RoHS Compliant)


  • 88MHz-108MHz
  • 400-500MHz
  • 780MHz - 960MHz (ISM)
  • 1.5 - 1.6 GHz (GPS)
  • 1.9GHZ (DECT)
  • 2.45 GHz (Bluetooth™, 802.11 b+g)
  • 2.5 - 2.9 GHz
  • 3.1 - 10.3 GHz (UWB)
  • 5.4GHz WiFi
  • 5.25 - 5.75 GHz (UNII, 802.11a)
Johanson Technology is proud to offer the latest in Chip Antenna technology. These LTCC based Chip Antennas are leading the industry based on gain and size (footprint) performance in the portable wireless arena. Currently, we offer solutions in the following frequency bands:

In addition to the array of listed components we can support custom solutions for high volume applications with design flexibility and short development times.
Contact us today with your specific technical requirements.

Case Size Summary

case 07-1 Johanson Technology
case 14-1 Johanson Technology
case 14-2 Johanson Technology
case 15-1 Johanson Technology
case 15-2 Johanson Technology
case 15-3 Johanson Technology
case 15-4 Johanson Technology
case 18-1 Johanson Technology
case 18-2 Johanson Technology
case 18-3 Johanson Technology
case 18-4 Johanson Technology
case 39-1 Johanson Technology
case 39-2 Johanson Technology
case 39-3 Johanson Technology
case 41-1 Johanson Technology
case 41-2 Johanson Technology

Soldering Profiles and Guidelines for SMT Ceramic Components

Typical Soldering Profile for Lead-free Process: RFCCs

Typical Soldering Profile for Lead-free Process: RFCCs
Typical Soldering Profile for Solderable Silver (Ag) Terminated Components:**
Typical Soldering Profile for Solderable Silver (Ag) Terminated Components:**
Lead Free Solder, i.e. SAC 305, is recommended
**Johanson Technology′s P/N's with Solderable Silver (Ag/Pt) Terminations requiring Vacuum Packaging

Typical Soldering Profile for Tin / Lead Terminated Components:
Tin flow Soldering GraphTin Reflow Soldering Graph

Hand Soldering
The recommended temperature for hand soldering our integrated passives is 350C for 3-5sec max
The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order.
Lead Free Solder (SAC 305) is recommended

Example Circuit Diagram

IPC example diagram

Example Circuit Diagram Integrated Passives Part number Explanation PDF (49kb)

General format is: FFFFPPCCVBBBBT where:
FFFF is the 4 digit Frequency in Megahertz (unless otherwise specified)
PP is the 2 character Product code
AT = Antenna CP = Coupler
AM = Antenna Module Assembly CF = Coupler Filter
AS = Antenna Switch Module CH = Coupler Hybrid
AD = Dual-Band Antenna DP = Diplexer
BL = Balun FA = Filter Array
BD = Balun, Dual-Band FB = Filter-Balun
M = Chipset Specific Impedance-Matched Balun or Balun-Filter HP = High Pass Filter
BP = Band Pass Filter LD = Low Pass Filter, Dual-Band
CD = Coupler, Dual Band LP = Low Pass Filter
  NF = Notch Filter (Band-Stop Filter)
CC is the 2-digit Case Size Code (e.g. 07 is EIA 0402, 14 is EIA 0603, 15 is EIA 0805, 18 is EIA 1206)
V is a 1 character Version/Revision code
BBBB is 3 or 4 digit Bandwidth, differential impedance (baluns only), or specific chipset denomination
T is the character tape code:
Tape material Code
Paper Tape standard (EIA 0603 and smaller) T
Embossed Tape standard (EIA 0805 and larger) E
Paper Tape rotated (non-std, EIA 0603 and smaller)* A
Embossed Tape rotated (non-std, EIA 0805 and larger)* R
*Only available for selected components, please consult the factor for availability and MOQs that apply

  • 0868AT43A0020E is an 868MHz antenna, case size 43, revision “A” with 20MHz of Bandwidth, embossed tape & reel
  • 2450BM15A0002S is 2450MHz Impedance-matched Balun-BPF, case size 15 (EIA 0805), 100MHz BW, designed for to T.I. CC2530 chipset, bulk (loose) packaging