Integrated Passive Components ( RoHS Compliant)

Johanson Technology designes and manufactures a line of small, highly stable and integrated RF ceramic components manufactured with a proprietary LTCC (low temperature co-fired ceramic) process and materials. These components operate and thrive over several RF bands from 300MHz to 14GHz covering Cellular, DECT, WLAN, WiMax, all ISM, Bluetooth, 802.11 (a,b and g) and GPS applications.

Key Features:
  • Custom Solutions
  • LTCC (Low Temp Co-Fired Ceramics) Based Designs
  • Low Insertion Loss
  • Miniature Size / Ultra-Low Profiles
  • Extreamly Temperature Stable
  • Surface Mount
  • RoHS/REACH Compliant Standard, Use no Suffix

 

Johanson USB Dongle Device

Supported Application Bands:
  • All ISM bands (Industrial Scientific, and Medical)
    • 315/433/783/868/915/950/2400 MHz
  • GSM/EDGE/GPRS/DCS/PCS/WCDMA
  • All ISM bands (Industrial Scientific, and Medical)
    • 315/433/783/868/915/950/2400 MHz
  • GSM/EDGE/GPRS/DCS/PCS/WCDMA
  • Wireless LAN
  • Bluetooth
  • HomeRF
  • Zigbee operational bands
  • GPS
  • WiFi
  • Zigbee
  • UNII
  • WiMAX 802.16
  • MiMo
  • UWB
RFCC Group Capacitors image

Ceramic Chip Antennas ( RoHS Compliant)

Applications:
  • 88MHz-180MHz
  • 400-500MHz
  • 780MHz - 960MHz (ISM)
  • 1.5 - 1.6 GHz (GPS)
  • 1.9GHZ (DECT)
  • 2.45 GHz (Bluetooth™, 802.11 b+g)
  • 2.5 - 2.9 GHz
  • 3.1 - 10.3 GHz (UWB)
  • 5.4GHz WiFi
  • 5.25 - 5.75 GHz (UNII, 802.11a)

Johanson Technology is proud to offer the latest in Chip Antenna technology. These LTCC based Chip Antennas are leading the industry based on gain and size (footprint) performance in the portable wireless arena. Currently, we offer solutions in the following frequency bands:


In addition to the array of listed components we can support custom solutions for high volume applications with design flexibility and short development times.
Contact us today with your specific technical requirements.
Case Size Summary
case 07-1 Johanson Technology
case 14-1 Johanson Technology
case 14-2 Johanson Technology
case 15-1 Johanson Technology
case 15-2 Johanson Technology
case 15-3 Johanson Technology
case 15-4 Johanson Technology
case 18-1 Johanson Technology
case 18-2 Johanson Technology
case 18-3 Johanson Technology
case 18-4 Johanson Technology
case 39-1 Johanson Technology
case 39-2 Johanson Technology
case 39-3 Johanson Technology
case 41-1 Johanson Technology
case 41-2 Johanson Technology
Silverleads Profile

Storage Sensitive Material Technical Note and Soldering profile for components with Silver Leads/Pads

Abstract:
This technical note applies to components that require storage in Vacuum Sealed Bags due to Silver Platinum (AgPt) terminations or contacts.

Storage:
Silver Leaded components should not be exposed to moisture and air contaminants, such as sulfur and chlorine, which may adversely affect device solderability and electrical performance
The appearance of lead/pad tarnish can range from a slight discoloration of the leads to leads turning completely black.
Vacuum packaging is mandatory if device soldering will not occur within 168 hours after opening the Johanson Technology vacuum pack. If cumulative exposure outside a vacuum sealed container is 168 hours or longer, it may adversely affect the components’ solderability and electrical performance; therefore, AgPt leaded parts require vacuum sealing during periods of storage. It is recommended that a control log of exposure to air be maintained.
As preventative measure, a desiccant is placed at the bottom corner of every vacuum sealed bag at time of shipment.
A Caution label (Figure 1) is placed on the outside of the vacuum bag and on the reel to make the user aware of the special handling and storage conditions.
The shelf life of the packaged component is 18 months
Johanson Silverlead Caution message

Soldering Profile:
Typical Soldering Profile for Solderable Silver (Ag) Terminated Components:**
Johanson solder profile graph

**Johanson Technology’s P/N’s with Solderable silver Terminations. For a list of applicable part numbers go to: http://www.johansontechnology.com/integrated-passives/more-info/typical-soldering-profile.html

**Johanson Technology's P/N's with Solderable Silver (Ag/Pt) Terminations requiring Vacuum Packaging
0200FA18A0200 0300LA15A0300 0400FA15A0400 0400FA18A0400
0400LP15A0100 0433BM15A0001 0866BL15C200 0868BM15C0001
0869LD14A1810 0869LD14E1810 0870CF16A1810 0892DP15A1940
0892DP15B1850 0892DP15C1940 0892FB15A0100 0892LP07A0136
0896BL14B050 0896BM15A0001 0896BM15A0025 0896BM15B0016
0898BM15A0002 0900BL15A100 0900BL15C050 0900LD14B2450
0915BM15A0001 0953BM15A0001 1000ED18A0001 1200BP44A575
1200LP41B0500 1200LP41C0500 1400BP41A0550 1810BP07B200
1810BP07C200 1810LP07B200 1900HP41B0500 1900HP41C0500
1905BP18A0050 1906BP18C027 1906BP39B027 2025LP15A1225
2345FB39A0050 2350FB39A0050 2450BL07A0100 2450BM07A0004
2450BM07A0004 2450BM14_0007 2450BM14A0004 2450BM15A0015
2450BM15B0009 2450BP07A0100 2450BP08A0100 2450BP14C0100
2450BP14D0100 2450BP14E0100 2450BP14F0100 2450BP15D0100
2450BP15E0100 2450BP15F0100 2450BP15G0100 2450BP15J0100
2450BP15K0100 2450BP15P0100 2450BP15Q0100 2450BP15U0100
2450BP15V0100 2450BP39D100B 2450BP39D100C 2450BP39D100E
2450BP39F100 2450DP15R5400 2450DP15S5400 2450FB15A0100
2450HP15A100 2500BP15M400 2500FB16A0400 2500FB39A0050
2595FB16A0100 2595FB39A0050 2600BP14M0200 3350BP39A0500
3500FB16A0100 3500FB39A0050 3550BP14A0500 3550FB39B0050
3600BP14M0600 3600BP14N0600 3600BP15M600 5375BP15A0950
5400BP14A0950 5425BP15A1050 5525BP15B0750
Mechanical & Environmental Characteristics

The following data applies to all RF Ceramic Components except BP43 Filters.

Specification Test Paramaters
Solderability: No apparent damage. More than 75% of the terminal electrode shall be covered with new solder Preheat : 120 ± 5°C
Solder : 230 ± 5°C for 5 ± 1 sec
Thermal Shock:
(Temperature Cycle)
No apparent damage. Fulfill the electrical specification after test. One cycle/step 1: 85 ± 5°C for 20sec
One cycle/step 2: -40 ± 3°C for 20sec
Cycle time:30min
No. of cycles:100
Recovery: 1-2hrs
Heat Resistance: No apparent damage.
Fulfill the electrical specification after test.
Temperature : 85 ± 2°C
Duration : 24 ± 2 hrs
Recovery : 1-2hrs
Low Temperature Resistance: No apparent damage.
Fulfill the electrical specification after test.
Temperature : -40 ± 5°C
Duration : 24 ± 2 hrs
Recovery : 1-2hrs
Humidity Resistance: No apparent damage.
Fulfill the electrical specification after test.
Temperature : 85 ± 2°C
Humidity : 80 ~ 85% RH
Duration : 1000 ± 48 hrs
Recovery : 1-2hrs
Drop Shock: No apparent damage. Dropped onto hard wood from height of 50 cm for 3 times ; each x,y and z direction except terminal direction

*Operating temperature range : -40°C ~ + 85°C

Soldering Profiles and Guidelines for SMT Ceramic Components

Typical Soldering Profile for Lead-free Process: RFCCs

Flow Soldering Graph
Reflow Soldering Graph

Typical Soldering Profile for Solderable Silver (Ag) Terminated Components:**

ag Flow Soldering Graph
Reflow Soldering Graph

Lead Free Solder, i.e. SAC 305, is recommended

**Johanson Technology's P/N's with Solderable Silver (Ag/Pt) Terminations requiring Vacuum Packaging
0200FA18A0200 0300LA15A0300 0400FA15A0400 0400FA18A0400
0400LP15A0100 0433BM15A0001 0866BL15C200 0868BM15C0001
0869LD14A1810 0869LD14E1810 0870CF16A1810 0892DP15A1940
0892DP15B1850 0892DP15C1940 0892FB15A0100 0892LP07A0136
0896BL14B050 0896BM15A0001 0896BM15A0025 0896BM15B0016
0898BM15A0002 0900BL15A100 0900BL15C050 0900LD14B2450
0915BM15A0001 0953BM15A0001 1000ED18A0001 1200BP44A575
1200LP41B0500 1200LP41C0500 1400BP41A0550 1810BP07B200
1810BP07C200 1810LP07B200 1900HP41B0500 1900HP41C0500
1905BP18A0050 1906BP18C027 1906BP39B027 2025LP15A1225
2345FB39A0050 2350FB39A0050 2450BL07A0100 2450BM07A0004
2450BM07A0004 2450BM14_0007 2450BM14A0004 2450BM15A0015
2450BM15B0009 2450BP07A0100 2450BP08A0100 2450BP14C0100
2450BP14D0100 2450BP14E0100 2450BP14F0100 2450BP15D0100
2450BP15E0100 2450BP15F0100 2450BP15G0100 2450BP15J0100
2450BP15K0100 2450BP15P0100 2450BP15Q0100 2450BP15U0100
2450BP15V0100 2450BP39D100B 2450BP39D100C 2450BP39D100E
2450BP39F100 2450DP15R5400 2450DP15S5400 2450FB15A0100
2450HP15A100 2500BP15M400 2500FB16A0400 2500FB39A0050
2595FB16A0100 2595FB39A0050 2600BP14M0200 3350BP39A0500
3500FB16A0100 3500FB39A0050 3550BP14A0500 3550FB39B0050
3600BP14M0600 3600BP14N0600 3600BP15M600 5375BP15A0950
5400BP14A0950 5425BP15A1050 5525BP15B0750

www.johansontechnology.com/silverleads

Typical Soldering Profile for Tin / Lead Terminated Components:

Tin flow Soldering GraphTin Reflow Soldering Graph

Hand Soldering
The recommended temperature for hand soldering our integrated passives is 350C for 3-5sec max
Note:
The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order.
Lead Free Solder (SAC 305) is recommended

Example Circuit Diagram
IPC example diagram

 

Example Circuit Diagram

General format is: FFFFPPCCVBBBBT where:
FFFF is the 4 digit Frequency in Megahertz (unless otherwise specified)
PP is the 2 character Product code

AT = AntennaCP = Coupler
AM = Antenna Module AssemblyCF = Coupler Filter
AS = Antenna Switch ModuleCH = Coupler Hybrid
AD = Dual-Band AntennaDP = Diplexer
BL = BalunFA = Filter Array
BD = Balun, Dual-BandFB = Filter-Balun
BM = Chipset Specific Impedance-Matched Balun or Balun-FilterHP = High Pass Filter
BP = Band Pass FilterLD = Low Pass Filter, Dual-Band
CD = Coupler, Dual BandLP = Low Pass Filter
 NF = Notch Filter (Band-Stop Filter)

CC is the 2-digit Case Size Code (e.g. 07 is EIA 0402, 14 is EIA 0603, 15 is EIA 0805, 18 is EIA 1206)
V is a 1 character Version/Revision code
BBBB is 3 or 4 digit Bandwidth, differential impedance (baluns only), or specific chipset denomination
T is the character tape code:

Tape materialCode
Paper Tape standard (EIA 0603 and smaller)T
Embossed Tape standard (EIA 0805 and smaller)E
Paper Tape rotated (non-std, EIA 0603 and smaller)*A
Embossed Tape rotated (non-std, EIA 0805 and smaller)*R
*Only available for selected components, please consult the factor for availability and MOQs that apply

 

Examples:

  • 0868AT43A0020E is an 868MHz antenna, case size 43, revision “A” with 20MHz of Bandwidth, embossed tape & reel
  • 2450BM15A0002S is 2450MHz Impedance-matched Balun-BPF, case size 15 (EIA 0805), 100MHz BW, designed for to T.I. CC2530 chipset, bulk (loose) packaging